Capillary driven flow in micro scale surface structures

Microelectronic Engineering

Volumn 86, Issue 4-6, 2009, Pages 1317-1320

  Chen, Yongkang ^a   Melvin, Lawrence S ^a,b   Rodriguez, Santiago ^c   Bell, Donald ^a   Weislogel, Mark M ^a  

^a Portland State University   (United States)

^b SYNOPSYS INC   (United States)

^c PORTLAND COMMUNITY COLLEGE   (United States)

Author keywords

Capillary flow; DRIE; MEMS; Wet etch; Wicking

Indexed keywords

CAPILLARY FORCES; CAPILLARY RISE; DRIE; FLOW EXPERIMENTS; FLOW REGIMES; MICRO-SCALE; OPEN CHANNELS; SURFACE POROSITIES; VISCOUS FORCES; WET ETCH; WICKING; WICKING STRUCTURES;

CAPILLARITY; MEMS; MICROELECTROMECHANICAL DEVICES;

CAPILLARY FLOW;

EID: 67349108788     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.02.016     Document Type: Article

References (9)

1. Weislogel M.M. Adv. Space Res. 32 2 (2003) 163-170
2. Chen Y., Melvin III L.S., Weislogel M.M., Jenson R.M., Dhuey S., and Nealey P.F. Microelectron. Eng. 85 5-6 (2008) 1027-1030
3. Bico J., Tordeux C., and Quere D. Europhys. Lett. 55 2 (2001) 214-220
4. Ishino C., Reyssat M., Reyssat E., Okumura K., and Quéré D. Europhys. Lett. 79 (2007) 56005
5. Nilson R.H., Tchikanda S.W., Griffiths S.K., and Martinez M.J. Int. J. Heat Mass Trans. 49 (2006) 603-1618
6. Schwiebert M.K., and Leong W.H. IEEE Trans. Compon. Pack. C 19 2 (1996) 133-137
7. Chia Y.C., Lim S.H., Chian K.S., Yi S., and Chen W.T. Int. J. Microcirc. Electron. Pack. 22 4 (1999) 345-352
8. Washburn E. Phys. Rev. 17 3 (1921) 273-283
9. Romero L.A., and Yost F.G. J. Fluid Mech. 322 (1996) 109-129