A fixed-angle dynamic heat spreading model for (an)isotropic rear-cooled substrates

Journal of Heat Transfer

Volumn 130, Issue 12, 2008, Pages 1-9

  Vermeersch, Bjorn ^a   De Mey, Gilbert ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

Anisotropy; Dynamic; Fixed angle model; Heat spreading; Microelectronics; Thermal conduction

Indexed keywords

A-THERMAL; ACCURATE ESTIMATION; ANALYTICAL RESULTS; ANALYTICAL SOLUTIONS; AVERAGE RELATIVE ERROR; DYNAMIC BEHAVIORS; DYNAMIC HEAT; ELECTRONIC PACKAGING; FITTING PARAMETERS; HEAT POWER; HEAT SOURCES; HEAT SPREADING; RISETIMES; STATE RESISTANCE; TEMPERATURE RESPONSE; THERMAL CONDUCTION; THERMAL ENGINEERS; THERMAL IMPEDANCE; TIME-DEPENDENT;

ANISOTROPIC MEDIA; ANISOTROPY; CHIP SCALE PACKAGES; HEAT RESISTANCE; MICROELECTRONICS; SUBSTRATES;

DYNAMIC MODELS;

EID: 77955235778     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.2976557     Document Type: Article

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