Thermal conductivity and thermal expansions of aluminum/carbon composites based on wood templates

Materials Letters

Volumn 61, Issue 8-9, 2007, Pages 1849-1854

  Wang, Tian Chi ^a   Fan, Tong Xiang ^b   Zhang, Di ^b   Zhang, Guo Ding ^b   Xiong, Dang Sheng ^a  

^a NANJING UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Composite materials; Thermal properties; Wood

Indexed keywords

ALUMINUM; CARBON; MICROSTRUCTURE; THERMAL CONDUCTIVITY; THERMAL EXPANSION; WOOD;

AESTHETIC INNER STRUCTURES; POROUS CARBON;

COMPOSITE MATERIALS;

ALUMINUM; CARBON; THERMAL EXPANSION; WOOD;

EID: 33847691153     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2006.07.144     Document Type: Article

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