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Volumn , Issue , 2010, Pages 247-255

Dense 24 TX + 24 RX fiber-coupled optical module based on a holey CMOS transceiver IC

Author keywords

[No Author keywords available]

Indexed keywords

BULK SILICON; CLOSE INTEGRATION; CMOS AMPLIFIERS; CMOS IC; CMOS TRANSCEIVERS; DATA RATES; DC ELECTRICAL; ELECTRICAL CHARACTERIZATION; FIBER-COUPLING; FLIP CHIP; FULLY OPERATIONAL; GRID ARRAYS; HIGH-DENSITY; HIGH-SPEED; HIGH-SPEED PERFORMANCE; LASER DRIVER; OPTICAL I/O; OPTICAL MODULES; OPTICAL TRANSCEIVER MODULES; OPTOCHIPS; ORGANIC CARRIERS; PLUGGABLE CONNECTORS; SINGLE-CHIP; TEST CIRCUIT;

EID: 77955213065     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490966     Document Type: Conference Paper
Times cited : (15)

References (11)
  • 7
    • 25844510182 scopus 로고    scopus 로고
    • Low-cost wafer bumping
    • July/Sept.
    • P. A. Gruber et al., "Low-cost wafer bumping," IBM J. of Res. and Dev., vol.49, pp. 621-639, July/Sept. 2005.
    • (2005) IBM J. of Res. and Dev. , vol.49 , pp. 621-639
    • Gruber, P.A.1
  • 10
    • 77953924575 scopus 로고    scopus 로고
    • Huntsville AL
    • MEMS Optical Inc., Huntsville, AL, http://www.memsoptical.com/.
    • MEMS Optical Inc.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.