Electrical and fluidic C4 interconnections for inter-layer liquid cooling of 3D ICs

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1674-1681

  King Jr , Calvin R ^a   Zaveri, Jesal ^a   Bakir, Muhannad S ^a   Meindl, James D ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D ICS; 3-D INTEGRATION; 3D ARCHITECTURES; BATCH FABRICATION; FLUIDIC INTERCONNECTIONS; HEAT REMOVAL; HIGH PERFORMANCE PROCESSORS; HIGH POWER DENSITY; HIGH-PERFORMANCE MICROPROCESSORS; INTERCONNECT NETWORKS; KEY ELEMENTS; LIQUID COOLING; MICRO CHANNEL HEAT SINKS; MICROFLUIDIC NETWORKS; ON CHIPS; POWER DELIVERY; SEALING TECHNIQUE; SEALING TECHNOLOGY; SUPPLY CURRENTS; WAFER LEVEL;

COMPUTER ARCHITECTURE; COOLING; CUSTOMER SATISFACTION; ELECTRIC POWER TRANSMISSION; HEAT SINKS; INTEGRATION; LIQUIDS; TECHNOLOGY;

THREE DIMENSIONAL;

EID: 77955210738     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490755     Document Type: Conference Paper

References (11)

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