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2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Volumn , Issue , 2010, Pages

Development of practical thermal design technique of printed circuit boards for power electronics

(4) Hatakeyama, Tomoyuki a Ishizuka, Masaru a Nakagawa, Shinji a Watanabe, Kazumitsu a

a TOYAMA PREFECTURAL UNIVERSITY (Japan)

Author keywords

CFD analysis; Electrical equipment; Heatsink; PCB; Thermal network model

Indexed keywords

CFD ANALYSIS; ELECTRICAL EQUIPMENT; ELECTRICAL PACKAGE; KEY ISSUES; THERMAL ANALYSIS; THERMAL DESIGN TECHNIQUES; THERMAL DESIGNS; THERMAL NETWORK METHODS; THERMAL NETWORK MODELS; VARIABLE THERMAL CONDUCTIVITY; WIRING PATTERNS;

CARBON FIBER REINFORCED PLASTICS; COMPUTATIONAL FLUID DYNAMICS; DESIGN; ELECTRIC NETWORK ANALYSIS; ELECTRONICS ENGINEERING; HEAT SINKS; POWER ELECTRONICS; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT MANUFACTURE; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY; THERMOANALYSIS;

PRINTED CIRCUIT BOARDS;

EID: 77955201569 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ITHERM.2010.5501401 Document Type: Conference Paper

Times cited : (10)

References (7)

1
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- Practical Study of Thermal Network Method to Thermal Design of Electronics Equipment
- M. Ishizuka, S. Nakagawa and K. Koizumi, "Practical Study of Thermal Network Method to Thermal Design of Electronics Equipment", Proceedings of IMECE2006, IMECHE2006-13105, 2006
- Proceedings of IMECE2006, IMECHE2006-13105, 2006
- Ishizuka, M.¹ Nakagawa, S.² Koizumi, K.³

2
- 77955207909
- Thermal Conduction in High Density Printed Circuit Boards (in Japanese)
- W. Nakayama, "Thermal Conduction in High Density Printed Circuit Boards (in Japanese)", JSME RC227 Final Report, pp. 715-762, 2008
- (2008) JSME RC227 Final Report , pp. 715-762
- Nakayama, W.¹

3
- 77953928263
- Thermal Characterization of High-Density Interconnects in the Foam of Equivalent Thermal Conductivity
- W. Nakayama, K. Koizumi, T. Fukue, M. Ishizuka, T. Nakajima, H. Koike and R. Matsuki, "Thermal Characterization of High-Density Interconnects in the Foam of Equivalent Thermal Conductivity", Proc. of InterPACK2009, InterPACK2009-89086, 2009
- Proc. of InterPACK2009, InterPACK2009-89086, 2009
- Nakayama, W.¹ Koizumi, K.² Fukue, T.³ Ishizuka, M.⁴ Nakajima, T.⁵ Koike, H.⁶ Matsuki, R.⁷

4
- 77955213459
- Detailed Structure and Material Thermal Conductivity Measurement of Model Package (in Japanese)
- Y. Okugawa, "Detailed Structure and Material Thermal Conductivity Measurement of Model Package (in Japanese)", JSME RC181 Final Report, pp. 689-698, 2002
- (2002) JSME RC181 Final Report , pp. 689-698
- Okugawa, Y.¹

5
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- Do you really know the thermal conductivity of your boards?
- M. Esmailpour, "Do you really know the thermal conductivity of your boards?" Proc. of SEMI-THERM2009, pp. 55-64, 2009
- (2009) Proc. of SEMI-THERM2009 , pp. 55-64
- Esmailpour, M.¹

6
- 77955184716
- JSME ed., Maruzen Co.
- th Edition, Maruzen Co., 2009
- (2009) th Edition

7
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- Nikkan Kogyo Shimbun Co.
- N. Kunimine, Heat Design Complete Introduction for Electronics (in Japanese), Nikkan Kogyo Shimbun Co., 1997
- (1997) Heat Design Complete Introduction for Electronics (In Japanese)
- Kunimine, N.¹

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