Do you really know the thermal conductivity of your boards?

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2009, Pages 55-64

  Esmailpour, Mohsen ^a  

^a Teradyne Inc Woodland Hills   (United States)

Author keywords

Dielectric; ECAD; Land pattern; PCB; Thermal conductivity; Vias

Indexed keywords

DIELECTRIC; ECAD; LAND PATTERN; PCB; VIAS;

COMPUTER SOFTWARE; DIELECTRIC MATERIALS; LAND FILL; TEMPERATURE; THERMAL CONDUCTIVITY; THERMAL VARIABLES MEASUREMENT; THERMOANALYSIS; THERMOELECTRICITY; WASTE DISPOSAL;

PRINTED CIRCUIT BOARDS;

EID: 67649891434     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/STHERM.2009.4810743     Document Type: Conference Paper

References (9)

1. K. Azar and J. Graebner, "Experimental Determination of Thermal Conductivity of Printed Wiring Boards", Proceedings of the 12th IEEE SEMI-THERM Sym., 1996, pp.169-182.
2. Culham, R.J., and Yovanovich, M.M., "Factors Affecting the Calculation of Effective Conductivity in Printed Circuit Boards" Proc. of 10th ITHERM Conference, 1998, pp.413-420.
3. B. Joiner, "Evaluation of Thermal Characterization Techniques," Proc. of IEPS Conference, 1994, pp.460- 467.
4. J. Lohan, P. Tiilikka, C-M. Fager, and J. Rantala, "Effect of both PCB Thermal conductivity and Nature of Forced Convection Environment on Component Operating Temperature: Experimental Measurement and Numerical Prediction", Proc. of the 16th IEEE SEMI-THERM Symposium, 2000, P128-139. (Pubitemid 30861646)
5. R. Nelson, "Wiring Statistics and Prointed Wiring Board Thermal Conductivity", Proc. of the 17th IEEE SEMITHERM Sym., 2001, pp.252-260 (Pubitemid 32457204)
6. Y. Shabany, "Component size and Effective Thermal Conductivity of PCBs", Applied Thermal Technologies.
7. SEMI International Standards, 1996, G42-0996 & 1992 G42-88 "Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages", Packaging Volume
8. JEDEC EIA/JESDD51-7 & -9, 1999 & EIA/JESDD51-3, 1996 "Low & High Effective Thermal Conductivity Test Board For Leaded & Area Array Surface Mount Packages", Electronic Industries Association, Engineering Department.
9. Harvard Thermal Inc., publisher of TASPCB thermal analysis software tool for PCBs (http://www.harvardthermal.com/), Presently offered by ANSYS as Iceboard (http://www.ansys.com/products/iceboard.asp)