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Volumn , Issue , 2010, Pages

Performance and reliability of MEMS gyroscopes at high temperatures

Author keywords

MEMS gyroscope; Noise; Temperature; Thermal cycling

Indexed keywords

HIGH TEMPERATURE; MEMS GYROSCOPE; MEMS GYROSCOPE SENSORS; NOISE; NOISE TEMPERATURE; NOISE VARIATIONS; ROOM TEMPERATURE; ROTARY TABLES; SIGNAL OUTPUT; TEMPERATURE CYCLING; TEST MEASUREMENTS;

EID: 77955187527     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2010.5501319     Document Type: Conference Paper
Times cited : (34)

References (8)
  • 1
    • 77649334550 scopus 로고    scopus 로고
    • A Critical Review of MEMS Gyroscopes Technology and Commercialization Status
    • Steven Nasiri, "A Critical Review of MEMS Gyroscopes Technology and Commercialization Status," Inven Sense.
    • Inven Sense
    • Nasiri, S.1
  • 2
    • 52349090923 scopus 로고    scopus 로고
    • Effect of the temperature on the performance of silicon micro-machined gyroscope using rotating carrier
    • Wu, L.F and Zhang, F.X, "Effect of the temperature on the performance of silicon micro-machined gyroscope using rotating carrier" Control and Decision Conferee 2008.
    • Control and Decision Conferee 2008
    • Wu, L.F.1    Zhang, F.X.2
  • 5
    • 34249887103 scopus 로고    scopus 로고
    • Deformation Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Changes
    • June
    • Jin-Won Joo and Sung-Hoon Choa, "Deformation Behavior of MEMS Gyroscope Sensor Package Subjected To Temperature Changes," IEEE Transactions on Components and Packaging Technologies, VOL.30,No.2, June 2007
    • (2007) IEEE Transactions on Components and Packaging Technologies , vol.30 , Issue.2
    • Joo, J.-W.1    Choa, S.-H.2
  • 7
    • 48049116911 scopus 로고    scopus 로고
    • Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers
    • September 2006
    • Nagy,G, etal,"Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers", Therminic 2006, September 2006
    • (2006) Therminic
    • Nagy, G.1
  • 8
    • 34547814286 scopus 로고    scopus 로고
    • Accurate Assessment of Packaging Stress Effects on MEMS Sensors by Measurement and Sensor-Package Interaction Simulations
    • June
    • Zhang, Xin etal,"Accurate Assessment of Packaging Stress Effects on MEMS Sensors by Measurement and Sensor-Package Interaction Simulations" Microelectromechanical Systems, Journal of Volume 16, Issue 3, June 2007 Page(s): 639-649
    • (2007) Microelectromechanical Systems, Journal of , vol.16 , Issue.3 , pp. 639-649
    • Zhang, X.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.