A synchrotron micro-diffraction investigation of crystallographic texture of high-Sn alloy films and its effects on whisker growth

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 162-169

  Sarobol, Pylin ^a   Pedigo, Aaron ^a   Blendell, John ^a   Handwerker, Carol ^a   Su, Peng ^b   Li, Li ^b   Xue, Jie ^b  

^a Purdue University   (United States)

^b CISCO SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT CONDITIONS; BEAM SIZE; CRYSTALLOGRAPHIC TEXTURES; FINITE ELEMENT MODELS; GRAIN ORIENTATION; HIGH BRIGHTNESS; HIGH STRESS; INVERSE POLE FIGURES; PLATING PROCESS; PURE SN; SIGNIFICANT IMPACTS; SIMULATION RESULT; SN ALLOYS; STRAIN CONDITIONS; STRAIN/STRESS DISTRIBUTION; STRESS GRADIENT; SURFACE DEFECT FORMATION; SYNCHROTRON SOURCE; WHISKER GROWTH; X RAY BEAM;

COPPER ALLOYS; FINITE ELEMENT METHOD; LEAD; STIFFNESS MATRIX; SYNCHROTRONS; TEXTURES; TIN; TIN ALLOYS; X RAY DIFFRACTION; X RAYS;

GRAIN GROWTH;

EID: 77955187449     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490896     Document Type: Conference Paper

References (11)

1. Fisher, R. et al. "Accelerated Growth of Tin Whiskers," Acta Merallurgica, Vol.3, No.2 (1955), pp. 200-201
2. Sobiech, M. et al, "Driving force for Sn whisker growth in the system Cu-Sn," Applied Physics Letters, Vol.93, 011906 (2008).
3. Vagramyan, A. and Soloveva, Z. Technology of Electrodeposition (Teddington, England; English translation) 1961.
4. Rayne, J. and Chandrasekhar, B., "Elastic Constants of β Tin from 4.2°K to 300°K," Phys. Rev. Vol.120, No.5 (1960) pp.1658-1663.
5. B.Z. Lee and D.N. Lee, "Spontaneous Growth Mechanism of Tin Whiskers", Acta Metallurgica, Vol.46, No.10, pp. 3701-3714, 1998.
6. Boettinger, W. et al. "Whisker and Hillock Formation on Sn, Sn-Cu, and Sn-Pb Electrodeposits," Acta Materialia, Vol.53 (2005), pp. 5033-5050.
7. Pedigo, A. et al, "Whiskers, Hillocks, and Film Stress Evolution in Electroplated Sn and Sn-Cu Films," Proc. of the IEEE Elec. Comp. Conf., (2008), pp. 1498-1504.
8. P. Sarobol, A.E. Pedigo, P. Su, J.E. Blendell and C.A. Handwerker, "Changes in Defect Morphology and Texture in Sn-Cu and Sn-Cu-Pb Electroplated Films," in press for IEEE Transactions on Electronics Packaging Manufacturing, 2009.
9. A.E. Pedigo, P. Sarobol, J.E. Blendell, C.A. Handwerker, and P. Su, "Crystallographic Texture of Sn-based Electroplated Films," in press, IMAPS International Microelectronics and Packaging Society, 2009.
10. Wenk, H. et al, "Rietveld Texture Analysis of Dabie Shan Eclogite from TOF Neutron Diffraction Spectra," J. Appl. Cryst. Vol.34 (2001), pp.442-453.
11. Jie-Hua Zhao, Peng Su, Min Ding, Sheila Chopin, and Paul S. Ho, "Microstructure-Based Stress Modeling of Tin Whisker Growth", IEEE Transactions on Electronics Packaging Manufacturing, Vol.29, No.4, October 2006, pp. 265-273