Parametric acceleration transforms for lead-free solder joint reliability under thermal cycling conditions

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 682-691

  Ahmad, Mudasir ^a   Xie, Weidong ^a   Liu, Kuo Chuan ^a   Xue, Jie ^a   Towne, Dave ^a  

^a CISCO SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATION TRANSFORM; BACKWARD COMPATIBLE; CONSUMER MARKET; DIE SIZE; FIELD RELIABILITY; FINITE ELEMENT ANALYSIS; LEAD-FREE SOLDER JOINT; LIFE PERFORMANCE; LONG TERM; MISSION CRITICAL; PACKAGE DESIGNS; PB FREE SOLDERS; PB-FREE; PEAK TEMPERATURES; SIGNIFICANT FACTORS; SOLDER JOINTS; TEST DATA; TEST RESULTS; WIDE SPECTRUM;

ACCELERATION; MATHEMATICAL TRANSFORMATIONS; POLYCHLORINATED BIPHENYLS; RELIABILITY; SOLDERING ALLOYS; TEST FACILITIES; THERMAL CYCLING;

LEAD;

EID: 70349677358     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074087     Document Type: Conference Paper

References (11)

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