Reliability study of high-end Pb-free CBGA solder joint under various thermal cycling test conditions

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 109-116

  Xie, Dongji ^a   Gektin, Vadim ^b   Geiger, David ^a  

^a FLEXTRONICS INTERNATIONAL   (United States)

^b SUN MICROSYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATION FACTORS; BGA PACKAGE; BOARD-LEVEL RELIABILITY; CERAMIC BALL GRID ARRAYS; COEFFICIENT OF THERMAL EXPANSION; FINITE ELEMENT MODELS; HIGHEST TEMPERATURE; LEAD-FREE SOLDERING; MODELING RESULTS; NEUTRAL POINTS; PB-FREE; SECOND LEVEL; SOLDER JOINTS; TEMPERATURE CYCLES; TEMPERATURE CYCLING; TEMPERATURE PROFILES; TEMPERATURE RANGE; TEST DATA; TEST SETUPS; THERMAL CYCLING RELIABILITY; THERMAL CYCLING TEST;

ELECTRONICS PACKAGING; LEAD; RELIABILITY; SOLDERING; TEST FACILITIES; TESTING; THERMAL CYCLING;

THERMAL EXPANSION;

EID: 70349672913     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074004     Document Type: Conference Paper

References (11)

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