Balancing material and exergy flows for a PCB soldering process: Method and a case study

Proceedings of the 2010 IEEE International Symposium on Sustainable Systems and Technology, ISSST 2010

Volumn , Issue , 2010, Pages

  Saiganesh, Subramaniam ^a   Sekulic, Dusan P ^a  

^a UNIVERSITY OF KENTUCKY   (United States)

Author keywords

Exergy analysis; Manufacturing; PCB

Indexed keywords

AVAILABLE ENERGY; ENERGY AND EXERGY; EXERGY ANALYSIS; EXERGY FLOW; MANUFACTURING LINES; MANUFACTURING OPERATIONS; NON-ENERGY; PCB-BASED; RESOURCES USE; SOLDERING PROCESS; SUSTAINABILITY ANALYSIS;

ENERGY RESOURCES; MANUFACTURE; POLYCHLORINATED BIPHENYLS; STRATEGIC PLANNING; SUSTAINABLE DEVELOPMENT; TECHNOLOGY; THERMODYNAMICS;

EXERGY;

EID: 77955108828     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSST.2010.5507708     Document Type: Conference Paper

References (11)

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