-
1
-
-
17744381744
-
Filler treatment effects on the dielectric properties of a filled epoxy resin
-
Adohi, I.P., Guillermin, C., Rain, P. and Rowel, S.W. (2004) ‘Filler treatment effects on the dielectric properties of a filled epoxy resin’, Proceedings of the IEEE 2004, Annuals Report Conference on Electrical Insulation Dielectrics Phenomenon, p.158–161.
-
(2004)
Proceedings of the IEEE 2004, Annuals Report Conference on Electrical Insulation Dielectrics Phenomenon
, pp. 158-161
-
-
Adohi, I.P.1
Guillermin, C.2
Rain, P.3
Rowel, S.W.4
-
3
-
-
0035244851
-
Dielectric properties of epoxy/silica composites used for microelectronic packaging, and their dependence on post-curing
-
Gonon, P. and Sylvestre, A. (2001) ‘Dielectric properties of epoxy/silica composites used for microelectronic packaging, and their dependence on post-curing’, Journal of Materials Science: Materials in Electronics, Vol. 12, No. 81.
-
(2001)
Journal of Materials Science: Materials in Electronics
, vol.12
, Issue.81
-
-
Gonon, P.1
Sylvestre, A.2
-
4
-
-
0035927989
-
Combined effects of humidity and thermal stress on the dielectric properties of epoxy-silica composites
-
Gonon, P., Sylvestre, A., Teysseyre, J. and Prior, C. (2001) “Combined effects of humidity and thermal stress on the dielectric properties of epoxy-silica composites”, Materials Science and Engineering: B, Vol. 83, No. 1, p.158.
-
(2001)
Materials Science and Engineering: B
, vol.83
, Issue.1
, pp. 158
-
-
Gonon, P.1
Sylvestre, A.2
Teysseyre, J.3
Prior, C.4
-
5
-
-
0141939649
-
Effects of hydrothermal aging on the dielectric properties of epoxy molding compounds
-
Gonon, P., Sylvestre, A., Teysseyre, J. and Prior, C. (2003) ‘Effects of hydrothermal aging on the dielectric properties of epoxy molding compounds’, Proceedings of the 7th International Conference on Property Applied Dielectrics Materials, Vols. 1–3, p.936.
-
(2003)
Proceedings of the 7th International Conference on Property Applied Dielectrics Materials
, vol.1-3
, pp. 936
-
-
Gonon, P.1
Sylvestre, A.2
Teysseyre, J.3
Prior, C.4
-
8
-
-
9144248614
-
Interfaces are the dominant feature of dielectrics at the nanometeric level
-
Lewis, T.J. (2004) ‘Interfaces are the dominant feature of dielectrics at the nanometeric level’, IEEE Transactions on Dielectrics and Electrical Insulation, Vol. 11, No. 5, p.739.
-
(2004)
IEEE Transactions on Dielectrics and Electrical Insulation
, vol.11
, Issue.5
, pp. 739
-
-
Lewis, T.J.1
-
10
-
-
0027264228
-
The effect of silica surface modification on the dielectric properties of silica-filled epoxy compounds
-
Myslinski, P. and Lazowski, Z. (1993) ‘The effect of silica surface modification on the dielectric properties of silica-filled epoxy compounds’, Materials Chemistry and Physics, Vol. 33, Nos. 1–2, p.139.
-
(1993)
Materials Chemistry and Physics
, vol.33
, Issue.1-2
, pp. 139
-
-
Myslinski, P.1
Lazowski, Z.2
-
11
-
-
17744374776
-
Role of the interface in determining the dielectric properties of nanocomposites
-
Nelson, J.K., Utracki, L.A., MacCrone, R.K. and Reed, C.W. (2004) ‘Role of the interface in determining the dielectric properties of nanocomposites’, IEEE-CEIDP, p.314.
-
(2004)
IEEE-CEIDP
, pp. 314
-
-
Nelson, J.K.1
Utracki, L.A.2
MacCrone, R.K.3
Reed, C.W.4
-
12
-
-
0346361527
-
The glass transition of polymer – single walled carbon nanotube composite films
-
Pham, J.Q., Mitchell, C.A., Bahr, J.L., Tour, J.M., Krishnamoorti, R. and Green, P.F. (2004) ‘The glass transition of polymer – single walled carbon nanotube composite films’, Journal of Polymer Science Part B: Polymer Physics, Vol. 41, p.3339.
-
(2004)
Journal of Polymer Science Part B: Polymer Physics
, vol.41
, pp. 3339
-
-
Pham, J.Q.1
Mitchell, C.A.2
Bahr, J.L.3
Tour, J.M.4
Krishnamoorti, R.5
Green, P.F.6
-
13
-
-
27744530931
-
Polymer nanocomposite dielectrics-the role of the interface
-
Roy, M., Nelson, J.K., MacCrone, R.K., Schadler, L.S., Reed, C.W., Keefe, R. and Zenger, W. (2005) ‘Polymer nanocomposite dielectrics-the role of the interface’, IEEE Transactions on Dielectrics and Electrical Insulation, Vol. 12, p.629.
-
(2005)
IEEE Transactions on Dielectrics and Electrical Insulation
, vol.12
, pp. 629
-
-
Roy, M.1
Nelson, J.K.2
MacCrone, R.K.3
Schadler, L.S.4
Reed, C.W.5
Keefe, R.6
Zenger, W.7
-
14
-
-
0003962895
-
Engineered materials handbook
-
Schneider Jr., S.J., Davis, J.R., Davidson, G.M., Lampman, S.R., Woods, M.S. and Zorc, T.B. (1991) ‘Engineered materials handbook’, Engineering and Materials Handbook, Vol. 4.
-
(1991)
Engineering and Materials Handbook
, vol.4
-
-
Schneider, S.J.1
Davis, J.R.2
Davidson, G.M.3
Lampman, S.R.4
Woods, M.S.5
Zorc, T.B.6
-
15
-
-
14644431021
-
Influence of interphase and moisture on the dielectri spectroscopy of epoxy/silica composites
-
Sun, Y.Y., Zhang, Z.Q. and Wong, C.P. (2005) ‘Influence of interphase and moisture on the dielectri spectroscopy of epoxy/silica composites’, Polymer, Vol. 46, p.2297.
-
(2005)
Polymer
, vol.46
, pp. 2297
-
-
Sun, Y.Y.1
Zhang, Z.Q.2
Wong, C.P.3
-
16
-
-
0020190681
-
Fabrication of perovskite lead magnesium niobate
-
Swartz, S.L. and Shrout, T.R. (1982) ‘Fabrication of perovskite lead magnesium niobate’, Materials Research Bulletin, Vol. 17, p.1245.
-
(1982)
Materials Research Bulletin
, vol.17
, pp. 1245
-
-
Swartz, S.L.1
Shrout, T.R.2
-
17
-
-
33847256465
-
Post-curing influence on electrostatic charges deposited on epoxy/silica composites used for microelectronic packaging
-
Sylvestre, A., Ouajji, H., Gonon, P., Teysseyre, J., Jomni, F. and Raouadi, K. (2005) ‘Post-curing influence on electrostatic charges deposited on epoxy/silica composites used for microelectronic packaging’, Proceedings of the 7th Electronic Packaging Technology Conference, Vols. 1–2, p.744.
-
(2005)
Proceedings of the 7th Electronic Packaging Technology Conference
, vol.1-2
, pp. 744
-
-
Sylvestre, A.1
Ouajji, H.2
Gonon, P.3
Teysseyre, J.4
Jomni, F.5
Raouadi, K.6
-
19
-
-
9144222213
-
Dielectric nanocomposites with insulating properties
-
Tanaka, T., Montanari, G.C. and Mülhaupt, R. (2004) ‘Dielectric nanocomposites with insulating properties’, IEEE Transactions on Dielectrics and Electrical Insulation, Vol. 11, No. 5, p.763.
-
(2004)
IEEE Transactions on Dielectrics and Electrical Insulation
, vol.11
, Issue.5
, pp. 763
-
-
Tanaka, T.1
Montanari, G.C.2
Mülhaupt, R.3
-
20
-
-
0142258097
-
Molecular basis of the interphase dielectric properties of microelectronic and optoelectronic packaging materials
-
Todd, M.G. and Shi, F.G. (2003) ‘Molecular basis of the interphase dielectric properties of microelectronic and optoelectronic packaging materials’, IEEE Transactions on Components, Packaging and Technology, Vol. 26, No. 3, p.667.
-
(2003)
IEEE Transactions on Components, Packaging and Technology
, vol.26
, Issue.3
, pp. 667
-
-
Todd, M.G.1
Shi, F.G.2
|