Post-curing influence on electrostatic charges deposited on epoxy/silica composites used for microelectronic packaging

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 2, Issue , 2005, Pages 744-748

  Sylvestre, A ^a   Ouajji, H ^a,b   Gonon, P ^a   Teysseyre, J ^c   Jomni, F ^b   Raouadi, K ^b  

^a LABORATOIRE D ELECTROTECHNIQUE DE GRENOBLE   (France)

^b University Campus   (Tunisia)

^c STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC HUMIDITY; COMPOSITE MATERIALS; CURING; ELECTROSTATICS; EPOXY RESINS; MICROELECTRONICS; SILICA;

CORONA DISCHARGE; ELECTROSTATIC PROBES; SURFACE POTENTIAL DECAY (SPD);

ELECTRONICS PACKAGING;

EID: 33847256465     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. S.M. Lee, Epoxy resins, Marcel Dekker Inc., (New York and Basel 1988), Ed Clayton A.May pp.783-928
2. P. Molinié et al, J. Phys. D Appl. Phys., 28 (1995) pp. 1601-1610, 1995
3. I. P. Batra et al, "Charge carrier dynamics following pulse photoinjection," J. Appl. Phys. 42 (3), (1971), pp. 1124-1130
4. H. J. Wintle, "Surface charge decay in insulators with non-constant mobility and injection efficiency," J. Appl. Phys. 43 (7), (1972), pp.2927-2930
5. T.J. Sonnonstine et al, "Surface potential decay in insulators with field dependent mobility and injection efficiency," J. Appl. Phys. 46 (9), (1975), pp. 3975-3981