Materials modeling and development for use in double-exposure lithography applications

Journal of Micro/Nanolithography, MEMS, and MOEMS

Volumn 8, Issue 1, 2009, Pages

  Lee, Saul ^a   Jen, Kane ^a   Willson, C Grant ^a   Byers, Jeffrey ^b   Zimmerman, Paul ^b   Turro, Nicholas J ^c  

^a The University of Texas at Austin   (United States)

^b SEMATECH   (United States)

^c Howard Hughes Medical Institute   (United States)

Author keywords

Double patterning lithography; Double exposure lithography; Immersion lithography; Resolution enhancement techniques

Indexed keywords

COMPUTER SIMULATION; MODELS; PHOTOLITHOGRAPHY;

CONTRAST ENHANCEMENT; DEPTH OF FOCUS; DOUBLE EXPOSURE; DOUBLE PATTERNING LITHOGRAPHY; DOUBLE-EXPOSURE LITHOGRAPHY; EXPOSURE DOSE; EXPOSURE LATITUDE; FEATURE SIZES; IMAGING TOOLS; IMMERSION LITHOGRAPHY; INTERMEDIATE STATE; MATERIALS MODELING; NON-LINEAR RESPONSE; OPTICAL THRESHOLD; PHOTOLITHOGRAPHY TECHNOLOGY; PHYSICAL BARRIERS; PROCESS WINDOW; RESOLUTION ENHANCEMENT TECHNIQUE; RESOLUTION ENHANCEMENT TECHNOLOGY; TWO PHOTON;

MATERIALS;

EID: 77954990880     PISSN: 19325150     EISSN: 19325134     Source Type: Journal    
DOI: 10.1117/1.3095589     Document Type: Article

References (13)

1. B. F. Griffing and P. R. West, "Contrast enhanced lithography," Solid State Technol. 28, 152-157 (1985).
2. J. Byers, S. Lee, K. Jen, P. Zimmerman, N. J. Turro, and C. G. Willson, "Double exposure materials: Simulation study of feasibility," J. Photopolym. Sci. Technol. 20, 707-717 (2007).
3. M. M. Krayushkin, B. M. Uzhinov, A. Y. Martynkin, D. L. Dzhavadov, M. A. Kalik, V. L. Ivanov, F. M. Stoyanovich, L. D. Uzhinova, and O. Y. Zolotarskaya, "Thermally irreversible photochromic dithienylethenes," Int. J. Photoenergy 1, 183-190 (1999).
4. R. S. Becker and J. Michl, "Photochromism of synthetic and naturally occurring 2H-chromenes and 2H-pyrans," J. Am. Chem. Soc. 88, 5931-5933 (1966).
5. B. D. Grant, N. J. Clecak, R. J. Twieg, and C. G. Willson, "Deep UV photoresists I. Meldrum's diazo sensitizer," IEEE Trans. Electron Devices 28, 1300-1305 (1981). (Pubitemid 12448470)
6. P. R. West, G. C. Davis, and B. F. Griffing, "Contrast enhanced photolithography: Application of photobleaching process in microlithography, " J. Imaging Sci. 30, 65-68 (1986).
7. E. F. Fleet, S. Gonen, G. D. Cooper, and Z. Chen, "Programmable photolithographic mask and reversible photo-bleachable materials based on nano-sized semiconductor particles and their applications," PCT Int. Appl. WO2004053938 (2004).
8. S. M. Kuebler, K. L. Braun, W. Zhou, J. K. Cammack, T. Yu, C. K. Ober, S. R. Marder, and J. W. Perry, "Design and application of high-sensitivity two-photon initiators for three-dimensional microfabrication," J. Photochem. Photobiol., A 158, 163-170 (2003). (Pubitemid 36512122)
9. S. Zheng, A. Leclercq, J. Fu, L. Beverina, L. A. Padilha, E. Zojer, K. Schmidt, S. Barlow, J. Luo, S. H. Jiang, A. K. Y. Jen, Y. Yi, Z. Shuai, E. W. VanStryland, D. J. Hagan, J. L. Bredas, and S. R. Marder, "Two-photon absorption in quadrupolar bis(acceptor(-terminated chromophores with electron-rich bis(heterocycle(vinylene bridges," Chem. Mater. 19, 432-442 (2007).
10. B. Larijani, R. Woscholski, and C. A. Rosser, Chemical Biology: Applications and Techniques, pp. 172-174, Wiley, Chichester, England (2006).
11. D. Gelbart and V. A. Karasyuk, "UV thermoresists: Sub-100-nm imaging without proximity effects," Proc. SPIE 3676, 786-793 (1999).
12. G. H. Chapman, Y. Tu, and J. Peng, "Wavelength invariant Bi/In thermal resist as a Si anisotropic etch masking layer and direct-write photomask material," Proc. SPIE 5039, 472-483 (2003).
13. S. C. Chapra and R. P. Canale, Numerical Methods For Engineers: With Software and Programming, 4th ed., pp. 707-709, McGraw-Hill, New York (2002).