Effect of microstructure on thermal conductivity of Cu, Ag thin films

Journal of Nanoscience and Nanotechnology

Volumn 10, Issue 5, 2010, Pages 3406-3411

  Ryu, Sang ^a   Juhng, Woonam ^a   Kim, Youngman ^a  

^a Chonnam National University   (South Korea)

Author keywords

Microstructure; Temperature distribution; Thermal conductivity; Thin films

Indexed keywords

BOROSILICATE GLASS SUBSTRATES; BULK MATERIALS; CLOCK FREQUENCY; DEVICE OPERATIONS; GRAIN SIZE; LORENZ NUMBER; MACHINING TOOL; MEASUREMENT METHODS; METALLIC THIN FILMS; NUMBER DENSITY; PROCESSING VARIABLES; STABLE OPERATION; THERMAL PROPERTIES; THIN-FILM DEPOSITIONS;

BOROSILICATE GLASS; CARBON FIBER REINFORCED PLASTICS; COPPER; DEPOSITION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MACHINING; MAGNETIC FILMS; MATERIALS HANDLING EQUIPMENT; MICROSTRUCTURE; SEMICONDUCTOR DEVICES; SILVER; SUBSTRATES; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY; THERMAL EVAPORATION; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THIN FILMS; VAPOR DEPOSITION;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 77954985954     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2010.2302     Document Type: Conference Paper

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