Improvement of the adhesion of a galvanic metallization of polymers by surface functionalization using dielectric barrier discharges at atmospheric pressure

Plasma Processes and Polymers

Volumn 6, Issue SUPPL. 1, 2009, Pages

  Bonis, Jochen ^a   Dohse, Antje ^a   Hinze, Alena ^b   Thomas, Michael ^a   Klages, Claus Peter ^a,b   Möbius, Andreas ^c   Elbick, Danica ^c   Weidlich, Ernst Rudolf ^d  

^a FRAUNHOFER INSTITUTE FOR SURFACE ENGINEERING AND THIN FILMS IST   (Germany)

^b TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

^c Enthone GmbH   (Germany)

^d GRT GmbH and Co KG   (Germany)

Author keywords

Dielectric barrier discharge; Plasma activation; Plasma amination; Plasma printing; Plastic metallization

Indexed keywords

COPPER METALLIZATION; DIELECTRIC BARRIER DISCHARGE; DIELECTRIC BARRIER DISCHARGE PLASMAS; DIELECTRIC BARRIER DISCHARGES; ELECTROLESS METALLIZATION; ENVIRONMENTALLY-FRIENDLY; METALLIZATIONS; PEEL STRENGTH; PLASMA ACTIVATION; PLASMA PARAMETER; SURFACE CONCENTRATION; SURFACE FUNCTIONALIZATION; XPS SPECTROSCOPY;

ADHESION; AMINES; ATMOSPHERIC PRESSURE; COPPER CORROSION; FLOW CONTROL; FUNCTIONAL POLYMERS; METALLIZING; PALLADIUM; PLASMA APPLICATIONS; PLASMAS; POLYIMIDES; POLYMERS; PRINTING; SURFACE DISCHARGES;

DIELECTRIC DEVICES;

EID: 77954929989     PISSN: 16128850     EISSN: 16128869     Source Type: Journal    
DOI: 10.1002/ppap.200930606     Document Type: Conference Paper

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