Plasma-printing and galvanic metallization hand in hand-A new technology for the cost-efficient manufacture of flexible printed circuits

Electrochimica Acta

Volumn 54, Issue 9, 2009, Pages 2473-2477

  Möbius, Andreas ^a   Elbick, Danica ^a   Weidlich, Ernst Rudolf ^b   Feldmann, Klaus ^c   Schüßler, Florian ^c   Borris, Jochen ^d   Thomas, Michael ^d   Zänker, Antje ^d   Klages, Claus Peter ^d  

^a Enthone GmbH   (Germany)

^b GRT GmbH   (Germany)

^c UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

^d FRAUNHOFER INSTITUTE FOR SURFACE ENGINEERING AND THIN FILMS IST   (Germany)

Author keywords

Dielectric barrier discharge; Flexible printed circuits; Patterned metallization; Plasma printing; Plastic metallization

Indexed keywords

ATMOSPHERIC PRESSURE; DIELECTRIC DEVICES; ELECTRIC DISCHARGES; ELECTROPLATING; FLOW CONTROL; METALLIZING; POLYIMIDES; POLYMERS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; PRINTING;

ATMOSPHERIC PRESSURE DIELECTRIC BARRIER DISCHARGES; BATCH PLANTS; COST-EFFICIENT; DIELECTRIC BARRIER DISCHARGE; FLEXIBLE PRINTED CIRCUITS; INTERDIGITAL STRUCTURES; LINE WIDTHS; NEW TECHNOLOGIES; PATTERNED METALLIZATION; PEEL TESTS; PLASMA CONDITIONS; REEL-TO-REEL PRODUCTIONS;

PLASMAS;

EID: 60949103637     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2008.08.050     Document Type: Article

References (17)

1. Charbonnier M., Romand M., Harry E., and Alami M. J. Appl. Electochem. 31 (2001) 57
2. Friedrich J., Wittrich H., and Gähde J. Acta Polym. 31 (1980) 59
3. Zhu Y.Q., Kang E.T., Neoh K.G., Osipowicz T., and Chan L. J. Electrochem. Soc. 152 (2005) F107
4. Alami M., Charbonnier M., and Romand M. Plasmas and Polym. 1 (1996) 113
5. Yang G.H., Kang E.T., Neoh K.G., Zhang Y., and Tan K.L. Langmuir (2001) 211
6. Charbonnier M., Alami M., and Romand M. J. Electrochem. Soc. 143 (1996) 472
7. Hofmann H., and Spindler J. Verfahren der Oberflächentechnik (2004), Fachbuchverlag Leipzig im Carl Hanser Verlag p. 92
8. Bhusari D., Hayden H., Tanikella R., Bidstrup Allen S.A., and Kohl P.A. J. Electrochem. Soc. 152 (2005) F162
9. BCC Research Group, market research report "Flexible Circuits: Materials and Applications", January 2006.
10. Borris J., Thomas M., Klages C.-P., Faupel F., and Zaporojtchenko V. Plasma Processes Polym. 4 (2007) S482
11. Guimond S., Radu I., Czeremuszkin G., and Wertheimer M.R. Proceedings of the 8th International Symposium on High Pressure Low Temperature Plasma Chemistry. Pühajärve, Estland (2002) pp. 400 ff
12. Schröder K., Ihrke R., Meyer-Plath A.A., Finke B., Diener A., Nebe B., and Ohl A.S. Proceedings of the 16th International Symposium on Plasma Chemistry ISPC 16. Taormina, Sicily (2003)
13. Guimond S., Radu I., Czeremuszkin G., Carlsson D.J., and Wertheimer M.R. Plasmas Polym. 7 (2002) 71
14. Penache C., Bartels V., Geßner C., and Klages C.-P. Proceedings of the 16th International Conference on Phenomena in Ionized Gases. Greifswald, Germany (2003)
15. Ivanov V.B., Behnisch J., Holländer A., Mehdorn F., and Zimmermann H. Surf. Interface Anal. 24 (1996) 257
16. Penache C., Gessner C., Betker T., Bartels V., Holländer A., and Klages C.-P. IEE Nanobiotechnol. 151 (2004) 139
17. Kreitz S., Penache C., Thomas M., and Klages C.-P. Surf. Coat. Technol. 200 (2005) 676