Simulation of the substrate temperature field for plasma assisted chemical etching

Plasma Processes and Polymers

Volumn 6, Issue SUPPL. 1, 2009, Pages

  Meister, Johannes ^a   Böhm, Georg ^a   Eichentopf, Inga Maria ^a   Arnold, Thomas ^a  

^a LEIBNIZ INSTITUTE OF SURFACE ENGINEERING IOM   (Germany)

Author keywords

Computer modeling; Plasma jet; Surface temperature

Indexed keywords

CHEMICAL ETCHING; COMPREHENSIVE METHOD; COMPUTER MODELING; MATERIAL REMOVAL RATE; MODEL PARAMETERS; MOVING HEAT SOURCES; OPTICAL ELEMENTS; PROCESS SIMULATIONS; PURE CHEMICALS; REACTIVE PLASMAS; SUBSTRATE TEMPERATURE; SURFACE FIGURING; SURFACE TEMPERATURE DISTRIBUTION; SURFACE TEMPERATURES; TRANSIENT HEAT TRANSFER; WORK PIECES;

ATMOSPHERIC TEMPERATURE; ETCHING; HEAT TRANSFER; PLASMA ACCELERATORS; PLASMA JETS; PLASMAS; SURFACE PROPERTIES; TEMPERATURE MEASUREMENT;

COMPUTER SIMULATION;

EID: 77954911802     PISSN: 16128850     EISSN: 16128869     Source Type: Journal    
DOI: 10.1002/ppap.200930509     Document Type: Conference Paper

References (14)

1. T. Arnold, G. Böhm, A. Schindler, J. Vac. Sci Technol 2001, 19, 2586.
2. th ICP, Osaka 1999, p. 231.
3. K. Cheng, X. Chen, W. Pan, Plasma Chem. Plasma Process. 2006, 26, 211.
4. M. J. Remie, G. Särner, M. F. G. Cremers, A. Omrane, K. R. A. M. Schreel, M. Aldén, L. P. H. de Goey, Int. J. Heat Mass Transfer 2008, 51, 3144.
5. N. Bianco, O. Manca, S. Nardini, S. Tamburrino, "Transient heat conduction in solids irradiated by moving heat source", Excerpt from the Proceedings of the COMSOL Users Conference 2006, Milano.
6. C.-K. Kim, JSME Int. J. B 2005, 48, 618.
7. M. Masquère, P. Freton, J. J. Gonzalez, J. Phys. D-. Appl Phys. 2007, 40, 432.
8. J. W. Coburn, H. F. Winters, J. Vac. Sci. Technol 1979, 16, 391.
9. E. Gogolides, P. Vauvert, G. Kokkoris, G. Turban, A. G. Bou-douvis, J. Appl. Phys. 2000, 88, 5570.
10. D. L. Flamm, C. J. Mogab, E. R. Sklaver, J. Appl Phys. 1979, 50, 6211.
11. R. Dussart, A. L. Thomann, L. E. Pichon, L Bedra, N. Semmar, P. Lefaucheux, J. Mathias, Y. Tessier, Appl. Phys. Lett. 2008, 93, 131502.
12. H. Kersten, D. Rohde, H. Steffen, H. Deutsch, R. Hippler, G. H. P. M. Swinkels, G. M. W. Kroesen, Appl Phys. A 2001, 72, 531.
13. Comsol Multiphysics™: http://www.comsol.com.
14. J. H. Lienhard , IV, J. H. Lienhard , V, Eds., "A Heat Transfer Textbook", Phlogiston Press, Cambridge 2008.