Change in microstructures and mechanical properties during deep wire drawing of copper

Materials Science and Engineering: A

Volumn 527, Issue 21-22, 2010, Pages 5699-5707

  Hanazaki, Kenichi ^a   Shigeiri, Naoto ^b   Tsuji, Nobuhiro ^c  

^a YAZAKI CORPORATION   (Japan)

^b OSAKA UNIVERSITY   (Japan)

^c KYOTO UNIVERSITY   (Japan)

Author keywords

Accumulative roll bonding; Copper; Elongation; Grain subdivision; Microstructure; Severe plastic deformation; Strength; Ultrafine grains; Wire drawing

Indexed keywords

COPPER; ELECTRIC CONDUCTIVITY; ELONGATION; GRAIN BOUNDARIES; PLASTIC DEFORMATION; ROLL BONDING; STRAIN; TENSILE STRENGTH; WIRE;

ACCUMULATIVE ROLL BONDING; COPPER SHEETS; COPPER WIRES; DRAWING PROCESS; EQUIVALENT STRAINS; GRAIN SUBDIVISION; SEVERE PLASTIC DEFORMATIONS; STRENGTH; ULTRA FINE GRAIN; ULTRAFINE MICROSTRUCTURES;

MICROSTRUCTURE;

EID: 77954814989     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.05.057     Document Type: Article

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