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1
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0033355466
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New technology for fluidic microsystems based on PCB technology
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DOI 10.1016/S0924-4247(99)00062-X
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Merkel, T., Gräber, M., Pagel, L., "A new technology for fluidic microsystems based on PCB technology", Sensors and Actuators, vol. A77, pp. 98-105, 1999 (Pubitemid 30505966)
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(1999)
Sensors and Actuators, A: Physical
, vol.77
, Issue.2
, pp. 98-105
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Merkel, T.1
Graeber, M.2
Pagel, L.3
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2
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0033355466
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New technology for fluidic microsystems based on PCB technology
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DOI 10.1016/S0924-4247(99)00062-X
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Merkel, T., Gräber, M., Pagel, L., "A new technology for fluidic microsystems based on PCB technology", Sensors and Actuators, vol. A77, pp. 98-105, 1999 (Pubitemid 30505966)
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(1999)
Sensors and Actuators, A: Physical
, vol.77
, Issue.2
, pp. 98-105
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Merkel, T.1
Graeber, M.2
Pagel, L.3
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4
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0034830475
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A self-filling micropump based on PCB technology
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Wego, Ansgar, Pagel, L., "A self-filling micropump based on PCB technology", Sensors and Actuators, vol. A88 (3), pp. 220-226, 2001
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(2001)
Sensors and Actuators
, vol.A88
, Issue.3
, pp. 220-226
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Wego, A.1
Pagel, L.2
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5
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77954389661
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Microfluidic in PCB Technology
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ISBN-3-933339-06-5
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Pagel,L.: Microfluidic in PCB Technology, ACTUATOR 2004, Bremen, ISBN-3-933339-06-5
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ACTUATOR 2004, Bremen
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Pagel, L.1
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6
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77951586643
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Thermomechanisches Mikroventil mit Zustandsrückmeldung
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German patent: DE10250758A1
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M. Weicker, L. Pagel, M. Hämmerle, Thermomechanisches Mikroventil mit Zustandsrückmeldung, German patent: DE10250758A1, 2004
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(2004)
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Weicker, M.1
Pagel, L.2
Hämmerle, M.3
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7
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77954412709
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A 3D-package technology for fluidic applications based on MATC-X
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F. Schindler-Saefkow, K. Amiri Jam, V. Großer, H. Reichl, "A 3D-package technology for fluidic applications based on MATC-X", ACTUATOR 2004, 9th International Conference on New Actuators, Bremen, Germany, 14-16 June 2004
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ACTUATOR 2004, 9th International Conference on New Actuators, Bremen, Germany, 14-16 June 2004
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Schindler-Saefkow, F.1
Amiri Jam, K.2
Großer, V.3
Reichl, H.4
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8
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77954387888
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3D-PCB-Packaging Technology for Electric and Fluidic Applications
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München, October 5-6
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Florian Schindler-Saefkow, Hendrik Schramm, Kourosh Amiri Jam, Stefan Gaßmann: "3D-PCB-Packaging Technology for Electric and Fluidic Applications", Micro System Technologies 2005, München, October 5-6, 2005, p.p. 385-389
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(2005)
Micro System Technologies 2005
, pp. 385-389
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Schindler-Saefkow, F.1
Schramm, H.2
Jam, K.A.3
Gaßmann, S.4
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9
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77954394132
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Maskless Lithographic PCB/Laminate MEMS for a Salinity Sensing System
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D. Fries, G. Steimle, S. Natarajan, S. Ivanov, H. Broadbent, T. Weller, "Maskless Lithographic PCB/Laminate MEMS for a Salinity Sensing System", IMAPS 35th Annual Symposium on Microelectronics, Denver, CO, USA, September 2002.
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IMAPS 35th Annual Symposium on Microelectronics, Denver, CO, USA, September 2002
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Fries, D.1
Steimle, G.2
Natarajan, S.3
Ivanov, S.4
Broadbent, H.5
Weller, T.6
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11
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84877741440
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Pressure Sensor in Printed Circuit Board Technology
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M. Hämmerle, L, Pagel; "Pressure Sensor in Printed Circuit Board Technology", International Conference on Device Packaging March 2009, IMAPS, Scottsdale, Arizona
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International Conference on Device Packaging March 2009, IMAPS, Scottsdale, Arizona
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Hämmerle, M.1
Pagel, L.2
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12
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84877299072
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Microfluidic Systems in PCB Technology
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Pagel,L; Gassmann,S: Microfluidic Systems in PCB Technology, International Conference on Device Packaging März 2008, IMAPS, Scottsdale, Arizona
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International Conference on Device Packaging März 2008, IMAPS, Scottsdale, Arizona
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Pagel, L.1
Gassmann, S.2
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13
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77954418275
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Printed Circuit Boards in Micro Fluidic Applications
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oral presentation
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S. Gassmann, L. Pagel: Printed Circuit Boards in Micro Fluidic Applications, 1. China SMT Forum 2007, 22. - 23. March 2007, Shanghai, China, oral presentation
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1. China SMT Forum 2007, 22. - 23. March 2007, Shanghai, China
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Gassmann, S.1
Pagel, L.2
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14
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33749674517
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Microfluidic Systems in PCB Technology
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Pagel,L.; Gassmann,S.: Microfluidic Systems in PCB Technology, 31st Annual Conference of the IEEE Industrial Engineering Society, Raleigh, NC, USA, Nov. 6-10, 2005.
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31st Annual Conference of the IEEE Industrial Engineering Society, Raleigh, NC, USA, Nov. 6-10, 2005
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Pagel, L.1
Gassmann, S.2
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15
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34247634617
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Development of a micro-manipulator based on piezoelectric-technology
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May-August
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H. Götze, L. Pagel: Development of a micro-manipulator based on piezoelectric-technology, Microelectronic Engineering, Volume 84, Issues 5-8, May-August 2007, Pages 1333-1336
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(2007)
Microelectronic Engineering
, vol.84
, Issue.5-8
, pp. 1333-1336
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Götze, H.1
Pagel, L.2
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16
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47349089847
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Design and Testing of an static laminar diffusion mixer with convective cross mixture based on PCB technology
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Göteborg, Sweden
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H. Götze, St. Gaßmann, L. Pagel: "Design and Testing of an static laminar diffusion mixer with convective cross mixture based on PCB technology", Micromechanics Europe 2005, Göteborg, Sweden, pp. 334-337, 2005
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(2005)
Micromechanics Europe 2005
, pp. 334-337
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Götze, H.1
Gaßmann, St.2
Pagel, L.3
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17
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77954409794
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Micro FIA in PCB Technology
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München, October 5-6
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Stefan Gassmann, Lienhard Pagel: "Micro FIA in PCB Technology", Micro System Technologies 2005, München, October 5-6, 2005, p.p. 594-596
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(2005)
Micro System Technologies 2005
, pp. 594-596
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Gassmann, S.1
Pagel, L.2
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18
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50049084354
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Flow injection analysis realized using PCBs
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Pagel,L.; Gassmann,S.: Flow injection analysis realized using PCBs, 32st Annual Conference of the IEEE Industrial Engineering Society, Vigo, Spain, Juni. 6-10, 2007.
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32st Annual Conference of the IEEE Industrial Engineering Society, Vigo, Spain, Juni. 6-10, 2007
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Pagel, L.1
Gassmann, S.2
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19
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33845574211
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Realization of a flow injection analysis in PCB technology
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Elsevier, 8 January
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S. Gassmann, I. Ibendorf, L. Pagel: Realization of a flow injection analysis in PCB technology. Elsevier, Sensors and Actuators A: Physical, Volume 133, Issue 1 , 8 January 2007, Pages 231-235
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(2007)
Sensors and Actuators A: Physical
, vol.133
, Issue.1
, pp. 231-235
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Gassmann, S.1
Ibendorf, I.2
Pagel, L.3
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20
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77954408327
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Micro flow injection analysis in PCB technology
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S. Gassmann, L. Pagel: "Micro flow injection analysis in PCB technology", ACTUATOR 2006, 10th International Conference on New Actuators, 14.-16. June 2006, Bremen, Germany, conference proceedings: P. 281-284
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ACTUATOR 2006, 10th International Conference on New Actuators, 14.-16. June 2006, Bremen, Germany, Conference Proceedings
, pp. 281-284
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Gassmann, S.1
Pagel, L.2
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22
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84877784170
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Improvements of a PCB technology for micro fluidic devices
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S. Gassmann, L. Pagel: "Improvements of a PCB technology for micro fluidic devices", International Conference on Device Packaging März 2009, IMAPS, Scottsdale, Arizona
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International Conference on Device Packaging März 2009, IMAPS, Scottsdale, Arizona
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Gassmann, S.1
Pagel, L.2
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23
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77954408327
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Micro flow injection analysis in PCB technology
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S. Gassmann, L. Pagel: "Micro flow injection analysis in PCB technology", ACTUATOR 2006, 10th International Conference on New Actuators, 14.-16. June 2006, Bremen, Germany, conference proceedings: P. 281-284
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ACTUATOR 2006, 10th International Conference on New Actuators, 14.-16. June 2006, Bremen, Germany, Conference Proceedings
, pp. 281-284
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Gassmann, S.1
Pagel, L.2
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24
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84877752648
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Fluidic Systems in Printed Circuit Board Technology
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L. Pagel, S. Gassmann, "Fluidic Systems in Printed Circuit Board Technology", International Conference on Device Packaging März 2009, IMAPS, Scottsdale, Arizona
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International Conference on Device Packaging März 2009, IMAPS, Scottsdale, Arizona
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Pagel, L.1
Gassmann, S.2
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