Fatigue damage of copper with ultra-fine structure due to ECAP

Zairyo/Journal of the Society of Materials Science, Japan

Volumn 53, Issue 10, 2004, Pages 1117-1123

  Goto, Masahiro ^a   Han, Seung Zeon ^b   Lim, Cha Yong ^b   Yakushiji, Terutoshi ^c   Morita, Tetsushi ^d   Yamamoto, Takaei ^a  

^a OITA UNIVERSITY   (Japan)

^b Korea Institute of Machine and Materials   (South Korea)

^c OITA NATIONAL COLLEGE OF TECHNOLOGY   (Japan)

^d SEIKO EPSON CORPORATION   (Japan)

Author keywords

Copper; Crack initiation; Crack propagation; ECAP; Fatigue damage; Grain boundary sliding; Ultra fine grain

Indexed keywords

BLENDING; COPPER; CRACK INITIATION; CRACK PROPAGATION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; TRANSMISSION ELECTRON MICROSCOPY;

EQUAL CHANNEL ANGULAR PRESSING (ECAP); FATIGUE DAMAGE; GRAIN BOUNDARY SLIDING; ULTRA FINE GRAIN; ULTRA FINE STRUCTURE;

FATIGUE OF MATERIALS;

EID: 10844255839     PISSN: 05145163     EISSN: None     Source Type: Journal    
DOI: 10.2472/jsms.53.1117     Document Type: Article

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