Designing environmentally sustainable computer systems using networks of exergo-thermo-volume building blocks

Proceedings of the ASME InterPack Conference 2009, IPACK2009

Volumn 2, Issue , 2010, Pages 663-671

  Shah, Amip ^a   Patel, Chandrakant ^a   Bash, Cullen ^a  

^a HEWLETT PACKARD LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BUILDING BLOCKES; COOLING SOLUTIONS; COUPLED BOUNDARY CONDITIONS; ENTERPRISE SERVERS; HEAT DISSIPATING COMPONENTS; HEAT SOURCES; ITERATIVE DESIGN; LCA METHODS; LIFE-CYCLE ASSESSMENTS; OPTIMAL SOLUTIONS; OPTIMAL SYSTEM DESIGN; SUB-OPTIMAL CHOICES; SUSTAINABLE DESIGN; SUSTAINABLE SYSTEMS; THERMAL MANAGEMENT;

OPTIMAL SYSTEMS; OPTIMIZATION; PRODUCT DESIGN; SUSTAINABLE DEVELOPMENT;

LIFE CYCLE;

EID: 77953935041     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/InterPACK2009-89037     Document Type: Conference Paper

References (30)

1. PriceWaterhouseCoopers, 2008, Going green: sustainable growth strategies. Technical Report (February).
2. Forrester Research, 2007, In search of green technology consumers. Technical Report (November).
3. Dincer, I., Rosen, M., 2007, Exergy: Energy, Environment and Sustainable Development, Elsevier, NY.
4. Sengupta, S., Datta, A., Duttagupta, S., 2007, "Exergy analysis of a coal-based 210 MW thermal power plant," International Journal of Energy Research, Vol. 31, No. 1, pp. 14-28. (Pubitemid 46647047)
5. Hotz, N., Senn, S. M., Poulikakos, D., 2006, "Exergy analysis of a solid oxide fuel cell micropowerplant," Proceedings of the 13th International Heat Transfer Conference (IHTC-13), Sydney, Australia.
6. Szargut, J., Morris, D. R., Steward, F. R., 1988, Exergy Analysis of Thermal, Chemical and Metallurgical Processes, Hemisphere, NY.
7. Haseli, Y., Dincer, I., Naterer, G. F., 2008, "Unified approach to exergy efficiency, environmental impact and sustainable development for standard thermodynamic cycles," International Journal of Green Energy, Vol. 5, pp. 105-119. (Pubitemid 351338378)
8. Sciubba, E., 2005, "Exergo-economics: thermodynamic foundation for a more rational resource use," Int. J. Energy Research, Vol. 29, No. 7, pp. 613-636. (Pubitemid 40830037)
9. Balocco, C., et al., 2004, "Using Exergy to Analyze the Sustainability of an Urban Area," Ecological Economics, Vol. 48, No. 2, pp. 231-244. (Pubitemid 38215242)
10. Sciubba, E., 2001, "Beyond Thermoeconomics? The Concept of Extended Exergy Accounting and its Application to the Analysis and Design of Thermal Systems," Exergy - An International Journal, Vol. 1, No. 2, pp. 68-84.
11. Creyts, J. C., Carey, V. P., 1999, "Use of Extended Exergy Analysis to Evaluate the Environmental Performance of Machining Processes," Proceedings of the Institute of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, Vol. 213, No. 4, pp. 247-264.
12. Dewulf, J., Van Langenhove, H., 2004, "Thermodynamic Optimization of the Life Cycle of Plastics by Exergy Analysis," Int. J. Energy Res., Vol. 28, No. 11, pp. 969-976. (Pubitemid 39174690)
13. Rosen, M.A., Dincer, I., 1997, "On Exergy and Environmental Impact," Int. J. Energy Research, Vol. 21, No. 7, pp. 643-654.
14. Zvolinschi, A., et al., 2007, "Exergy Sustainability Indicators as a Tool in Industrial Ecology," J. Industrial Ecology, Vol. 11, No. 4, pp. 85-98.
15. EPA, 2007, Report to Congress on Server and Data Center Energy Efficiency. US Environmental Protection Agency, EnergyStar Program.
16. Mingay, S., 2008, "IT's role in a Low Carbon Economy." Presentation at Gartner Symposium IT Expo, Cannes, France.
17. th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), San Diego, CA.
18. Schmidt, R., et al, 2005, "Maintaining Datacom Rack Inlet Air Temperatures with Water Cooled Heat Exchangers," Proc. InterPACK, San Francisco, CA.
19. VanGilder, J. W., Shrivastava, S. K., 2007, "Capture Index: An Airflow-Based Rack Cooling Performance Metric," ASHRAE Transactions, Vol. 113, No. 1.
20. Bar-Cohen, A., Iyengar, M., 2003, "Least-Energy Optimization of Air-Cooled Heat Sinks for Sustainable Development," IEEE Trans. Comp. Pkg. Tech., Vol. 26, No. 1, pp. 16-25.
21. Bar-Cohen, A., Iyengar, M., 2002, "Design and Optimization of Air-cooled Heat Sinks for Sustainable Development," IEEE Trans. Comp. Pkg. Tech., Vol. 25, No. 4, pp. 584-591.
22. Mohite, S., Zhang, H.-C., 2005, "Disassembly Analysis, Material Composition Analysis and Environmental Impact Analysis for Computer Disk Drives," Proc. IEEE Intl. Symp. Electronics and the Environment, New Orleans, LA.
23. Williams, E., 2002, "The 1.7 kg microchip: energy and chemical use in the production of semiconductors," Proc. Intl. Symp. on Information Technology and the Environment, Tokyo, Japan.
24. Williams, E., Hatanaka, T., 2005, "Residential Computer Usage Patterns in Japan and Associated Life Cycle Energy Use," Proc. IEEE Intl. Symp. Electronics and the Environment, New Orleans, LA, pp. 177-182.
25. Hannemann, C. R., Carey, V. P., Shah, A. J., Patel, C., 2008, "Lifetime exergy consumption as a sustainability metric for enterprise servers," Proceedings of the ASME Energy Sustainability Conference (ES), Jacksonville, FL.
26. Shah, A., Patel, C., 2009, "Designing Environmentally Sustainable Cooling Solutions using Exergo-Thermo-Volumes," International Journal of Energy Research (in press).
27. Bash, C., Patel, C., 1997, "Modeling and Metrology for Expedient Analysis and Design of Computer Systems," Intl. J. Microelectronics and El. Pkg., Vol. 22, No. 2, pp. 157-163.
28. Lim, K., et al., 2008, "Understanding and Designing New Server Architectures for Emerging Warehouse-Computing Environments," Proc. 35th Annual International Symposium on Computer Architecture (ISCA-35), Beijing, China.
29. Shah, A., Carey, V., Bash, C., Patel, C., 2006, "An Exergy-Based Figure-of-Merit for Electronic Packages," Journal of Electronic Packaging, Vol. 128, No. 4, pp. 360-369.
30. Hewlett Packard. HP Proliant DL385 Generation 5 Overview. Available online http://h18004.www1.hp.com/products/quickspecs/13012-a/13012-a.html