Modeling and metrology for expedient analysis and design of computer systems

International Journal of Microcircuits and Electronic Packaging

Volumn 22, Issue 2, 1999, Pages 157-163

  Bash, Cullen ^a   Patel, Chandrakant ^a  

^a HEWLETT PACKARD LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SYSTEM LEVEL THERMAL PERFORMANCE; THERMAL DESIGN; THERMO VOLUME RESISTANCE;

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; DESIGN; HEAT RESISTANCE; HEAT SINKS; PERFORMANCE; THERMAL EFFECTS;

COMPUTER SYSTEMS;

EID: 0032645787     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

1. C.D. Patel, C. L. Belady, "Modeling and Metrology in High Performance Heat Sink Design", Proceedings of the Electronic Components and Technology Conference, ECTC' 97, San Jose, California, pp. 296-302, May 1997.
2. S.V. Patankar, "Numerical Heat Transfer and Fluid Flow", Taylor & Francis Publishers, 1980.
3. V. Mansingh, N. Kazuhiro, S. Shidore, S. Addison, "Heat Sinks for High Power Multichip Modules", Proceedings of the International Electronics Packaging Society Conference, IEPS '96, pp. 410-421, 1996.
4. F.P. Incropera, D.P. De Witt, "Fundamentals of Heat and Mass Transfer", Wiley, pg. 472, 1990.
5. M.N. Ozisik, "Heat Transfer: A Basic Approach", McGraw-Hill, Mexico, pg. 293, 1985.
6. L.F. Moody, "Friction Factors for Pipe Flow", Transactions of the ASME, Vol. 66, No. 8, pp. 671-684, November 1944.
7. Airflow Measurement Systems, P.O. Box 2491, Current Updated Literature, Chula Vista, California 91912.
8. R. R. Tummala E. J. Rymaszewski, "Microelectronics Packaging Handbook ", Van Nostrand Reinhold, New York, pp. 175-180, 1989.