An investigation into the penetration of phase change material in carbon foam for transient thermal management

Proceedings of the ASME InterPack Conference 2009, IPACK2009

Volumn 1, Issue , 2010, Pages 529-533

  Sanusi, Omar ^a   Weinstein, Randy D ^a   Fleischer, Amy S ^a  

^a Villanova University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

A-THERMAL; CARBON FOAM; CYCLIC OPERATION; EXPERIMENTAL DATA; HIGH CAPACITY; MATRIX; THERMAL MANAGEMENT; TRANSIENT THERMAL MANAGEMENT; VOLUME DISPLACEMENTS;

HEAT STORAGE; PHASE CHANGE MATERIALS; TEMPERATURE CONTROL;

FOAMS;

EID: 77953749442     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/InterPACK2009-89070     Document Type: Conference Paper

References (20)

1. M. Fang, G. Chen, "Effects of Different Multiple PCMs on the Performance of a Latent Thermal Energy Storage System" Applied Thermal Engineering, vol. 27, pp. 994-1000, 2006.
2. th ASME-JSME Thermal Engineering Joint Conference, 2003
3. H.M. Ettouney, I. Alatiqi, M. Al-Sahali, S.A. Al-Ali, "Heat Transfer Enhancement By Metal Screens And Metal Spheres In Phase Change Energy Storage Systems," Renewable Energy, vol. 29, pp. 841-860, 2004.
4. R.S. Prasher, C. Simmons, G. Solbrekken, "Thermal Contact Resistance Of Phase Change And Grease Type Polymeric Materials," Proceedings of the ASME Manufacturing in Eng. Div., vol. 11, pp. 461-466, 2000.
5. M.H. Nurmawati, K.S. Siow, I.J. Rasiah, I.J., "Thermal Performance Of A Phase Change Material On A Nickel-Plated Surface," Thin Solid Films, vol. 462, pp. 481-486, 2004.
6. th IEEE SEMI-THERM Symposium, pp. 88-91, 2002.
7. M. Hodes, R.D. Weinstein, S.J. Pence, J.M. Piccini, L. Manzione, C. Chen, "Transient Thermal Management of a Handset Using Phase Change Material (PCM)," Journal of Electronic Packaging, vol. 124, pp. 419-426, 2002.
8. F.L. Tan, C.P. Tso, "Cooling Of Mobile Electronic Devices Using Phase Change Materials," Applied Thermal Engineering, vol. 24, pp. 159-169, 2004.
9. S.M. Hasnain, "Review Of Sustainable Thermal Energy Storage Technologies, Part I: Heat Storage Materials And Techniques," Energy Conv. Manag., vol. 39, pp. 1127-1138, 1998.
10. S. Krishnan, S.V. Garimella, S.S. Kang, "A Novel Hybrid Heat Sink Using Phase Change Material For Transient Thermal Management Of Electronics," IEEE Transactions on Components and Packaging Technologies, vol. 28, pp. 281-289, 2005.
11. M. Xiao, B. Feng, K. Gong, "Preparation And Performance Of Shape Stabilized Phase Change Thermal Storage Materials With High Thermal Conductivity," Energy Conversion and Management, vol. 43, pp. 103-108, 2002.
12. R. Velraj, "Heat Transfer Studies During Solidification Of PCM Inside An Internally Finned Tube," Journal of Heat Transfer, vol. 121, pp. 493-495, 1999.
13. P. Lamberg, K. Siren, "Analytical Model For Melting In A Semi-Infinite PCM Storage With An Internal Fin," Heat and Mass Transfer, vol. 39, pp. 167-176, 2003.
14. A. Siahpush, J. O'Brien, J. Crepeau, "Phase Change Heat Transfer Enhancement Using Copper Porous Foam," Paper 082301, Journal of Heat Transfer, vol. 130, 2008.
15. R. Wirtz, V. Narla, T. Zhao, Y. Jiang, "Non-Metallic and Stucturally Efficient Thermal Energy Storage Composites for Avionics Temperature Control, Part 1 : Thermal Characterization," Paper 0343, AIAA, 2004.
16. W. Ford, "Method of Making Cellular Refractory Thermal Insulating Material", US Patent 3,121,050, 1964.
17. J. Googin, J. Napier, M. Scrivner, "Method for Manufacturing Foam Carbon Products", US Patent 3,345,440, 1967.
18. J. W. Klett, A. McMillan, N. Gallego, "Carbon Foam for Electronics Cooling", National Laboratory Fuel Cell Annual Report, 2002.
19. A. S. Fleischer, K. Chintakrinda, R.D. Weinstein, C.A. Bessel, "Transient Thermal Management Using Phase Change Materials with Embedded Graphite Nanofibers for Systems with High Power Requirements", Paper 4544317, Proceedings of ITHERM 2008, pp. 561-566, 2008.
20. O.C. Sanusi, A.S. Fleischer, "An Investigation into the Cool-down Effects of Nano-Enhanced Phase Change Material for Transient Thermal Management of Naval Electronics."Paper IPACK2009-89068, Proceedings of InterPACK Conference, 2009.