A molecular dynamics study of thermal conductivity in nanocomposites via the phonon wave packet method

Proceedings of the ASME InterPack Conference 2009, IPACK2009

Volumn 1, Issue , 2010, Pages 607-615

  Tian, Zhiting ^a   Kim, Sang ^a   Sun, Ying ^a   White, Bruce ^a  

^a BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECT SIZE; EFFECTIVE MEDIUM; EFFECTIVE THERMAL CONDUCTIVITY; FREQUENCY RANGES; HEAT FLOWS; MATERIAL INTERFACES; MOLECULAR DYNAMICS SIMULATIONS; NANO-COMPOSITE STRUCTURE; NONEQUILIBRIUM MOLECULAR DYNAMICS; NORMAL INCIDENCE; PHONON WAVE PACKETS; TRANSMISSION COEFFICIENTS;

COMPUTER SIMULATION; FILM THICKNESS; MOLECULAR DYNAMICS; NANOCOMPOSITES; PHONONS; SILICON COMPOUNDS; THERMAL CONDUCTIVITY; THERMOANALYSIS; WAVE PACKETS; WAVES;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 77953745407     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/InterPACK2009-89272     Document Type: Conference Paper

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