Package designs and associated challenges for environment sensitive MEMS sensors

Proceedings of the ASME InterPack Conference 2009, IPACK2009

Volumn 1, Issue , 2010, Pages 501-505

  Sarihan, Vijay ^a   Wen, Jian ^a   Li, Gary ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

Die crack; Fracture mechanics; MEMS accelerometer; QFN; Resonance frequency; SOIC; Solder joint reliability

Indexed keywords

DIE CRACK; DIE CRACKS; MEMS ACCELEROMETER; RESONANCE FREQUENCIES; SOLDER JOINT RELIABILITY;

ACCELEROMETERS; CRACKS; DESIGN; DIES; FAILURE ANALYSIS; FRACTURE; FRACTURE MECHANICS; NATURAL FREQUENCIES; SENSORS;

PACKAGING;

EID: 77953742397     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/InterPACK2009-89330     Document Type: Conference Paper

References (5)

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