Designing small footprint, low-cost, high-reliability packages for performance sensitive MEMS sensors

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 817-818

  Sarihan, Vijay ^a   Wen, Jian ^a   Li, Gary ^a   Koschmieder, Thomas ^a   Hooper, Ryan ^a   Shumway, Russell ^a   Macdonald, James ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH-RELIABILITY; LOW COSTS;

ARSENIC COMPOUNDS; COMPUTER NETWORKS; COSTS; CUSTOMER SATISFACTION; FORECASTING; LIFE CYCLE; MEMS; RELIABILITY; SALES; SENSORS; STRESSES; TRANSDUCERS;

COMPOSITE MICROMECHANICS;

EID: 51349100473     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550069     Document Type: Conference Paper

References (3)

1. th Electronic Components and Technology Conf, Reno, NV, May. 2003.
2. Gary Li, Andrew McNeil, Dan Koury, Mike Chapman, Dave Monk, "Design of Transducer and Package at the same time," Proc IPACK2005 Conf, San Francisco, CA, July. 2005.
3. rd Electronic Components and Technology Conf, Orlando, FL, June. 2003.