Constitutive behaviour of copper ribbons used in solar cell assembly processes

2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Volumn , Issue , 2009, Pages

  Wiese, Steffen ^a   Meier, Rico ^a   Kraemer, Frank ^a   Bagdahn, Joerg ^a  

^a FRAUNHOFER CENTER FOR SILICON PHOTOVOLTAICS CSP   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CELL ASSEMBLY; CELL THICKNESS; CONSTITUTIVE BEHAVIOUR; CRITICAL STEPS; DRIVING FACTORS; HEAT-UP; KEY FACTORS; MANUFACTURING COST; MANUFACTURING PROCESS; MECHANICAL LOADS; MODULE RELIABILITY; PHOTOVOLTAIC MODULES; TEMPERATURE-INDUCED;

BRAZING; CELL MEMBRANES; COPPER; ENERGY CONVERSION; MELTING POINT; MICROELECTRONICS; MICROSYSTEMS; PHOTOVOLTAIC CELLS; POLYSILICON; SILICON WAFERS; SOLAR CELLS; SOLAR POWER GENERATION; WELDING;

STRESSES;

EID: 67650548161     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2009.4938464     Document Type: Conference Paper

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