Dielectric properties of epoxy-Al2O3 nanocomposite system for packaging applications

IEEE Transactions on Components and Packaging Technologies

Volumn 33, Issue 2, 2010, Pages 373-385

  Singha, Santanu ^a   Thomas, M Joy ^b  

^a ABB SWITZERLAND LTD   (Switzerland)

^b INDIAN INSTITUTE OF SCIENCE   (India)

Author keywords

AC dielectric strength; Dc resistivity; Dielectrics; Discharge resistance; Epoxy nanocomposites; Permittivity; Tan delta

Indexed keywords

DC RESISTIVITY; DIELECTRIC BEHAVIOR; DIELECTRIC CHARACTERISTICS; DIELECTRIC STRENGTHS; DISCHARGE RESISTANCE; DUAL LAYER; ELECTRICAL DISCHARGES; ELECTRONIC PACKAGING; EPOXY NANOCOMPOSITES; EPOXY SYSTEMS; FILLER LOADING; INTERFACE REGIONS; MICROCOMPOSITE; MULTI-FUNCTIONAL MATERIALS; NANOCOMPOSITE SYSTEMS; NANOFILLER; PACKAGING APPLICATIONS; POLYMER NANOCOMPOSITE; WIDE FREQUENCY RANGE;

DIELECTRIC MATERIALS; ELECTRIC DISCHARGES; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; FILLERS; LOADING; PACKAGING MATERIALS; PERMITTIVITY; TANNING;

NANOCOMPOSITES;

EID: 77953477584     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2033665     Document Type: Article

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