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Volumn 499, Issue 1, 2010, Pages 57-62

The effect of Cu addition on the hot deformation behavior of NiTi shape memory alloys

Author keywords

Dynamic restoration processes; Hot deformation; NiTi alloy; NiTiCu alloys

Indexed keywords

CONSTANT STRAIN RATE; CRITICAL STRESS; CU ADDITION; CU CONTENT; DYNAMIC RECOVERY; DYNAMIC RESTORATION; FLOW CURVES; HIGH STRENGTH; HOT COMPRESSION TESTS; HOT DEFORMATION; HOT DEFORMATION BEHAVIORS; NITI ALLOY; NITI ALLOYS; NITI SHAPE MEMORY ALLOYS; RECRYSTALLIZED GRAINS; SOLID SOLUTION HARDENING; TEMPERATURE RANGE; TRUE STRAIN;

EID: 77953165683     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.01.124     Document Type: Article
Times cited : (38)

References (40)
  • 20
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    • J.P. McCormick, Ph.D. Thesis, Georgia Institute of Technology (2006).
    • (2006)
    • McCormick, J.P.1
  • 28
    • 77953173977 scopus 로고
    • Ph.D. Thesis, Stanford University
    • W.J. Moberley, Ph.D. Thesis, Stanford University (1991).
    • (1991)
    • Moberley, W.J.1
  • 35
    • 77953160373 scopus 로고    scopus 로고
    • Light Metal Ternary Systems: Phase Diagrams, Crystallographic and Thermodynamic Data
    • Spring, Berlin/Heidelberg
    • Schuster J.C., and Cacciamani G. Light Metal Ternary Systems: Phase Diagrams, Crystallographic and Thermodynamic Data. Land olt- Bornstein-Group 5 Phys. Chem. vol. 11A4 (2006), Spring, Berlin/Heidelberg
    • (2006) Land olt- Bornstein-Group 5 Phys. Chem. , vol.11 A4
    • Schuster, J.C.1    Cacciamani, G.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.