Reliability evaluation for integrated circuit with defective interconnect under electromigration

Proceedings - International Symposium on Quality Electronic Design, ISQED

Volumn 2003-January, Issue , 2003, Pages 29-34

  Xuan, Xiangdong ^a   Singh, Adit D ^b   Chatterjee, Abhijit ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b AUBURN UNIVERSITY   (United States)

Author keywords

Acceleration; Circuit simulation; Current density; Degradation; Electromigration; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit reliability; Predictive models; Probability

Indexed keywords

ACCELERATION; CIRCUIT SIMULATION; CURRENT DENSITY; DEFECTS; DEGRADATION; ELECTROMIGRATION; INTEGRATED CIRCUITS; PROBABILITY; RELIABILITY;

CIRCUIT-LEVEL RELIABILITY; ELEVATED TEMPERATURE; INTEGRATED CIRCUIT INTERCONNECTIONS; INTEGRATED CIRCUIT MODELING; INTEGRATED CIRCUIT RELIABILITY; PREDICTIVE MODELS; PROBABILITY MODELING; RELIABILITY EVALUATION;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 33846698784     PISSN: 19483287     EISSN: 19483295     Source Type: Conference Proceeding    
DOI: 10.1109/ISQED.2003.1194705     Document Type: Conference Paper

References (6)

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