The origin of the ultrahigh strength and good ductility in nanotwinned copper

Materials Science and Engineering: A

Volumn 527, Issue 16-17, 2010, Pages 4270-4274

  Wang, Guoyong ^a   Li, Guangyu ^a   Zhao, Lei ^a   Lian, Jianshe ^a   Jiang, Zhonghao ^a   Jiang, Qing ^a  

^a Jilin University   (China)

Author keywords

Activation volume; Ductility; Strain rate sensitivity; Tensile; Twin

Indexed keywords

COPPER; NANOTECHNOLOGY; PILES; STRAIN HARDENING; STRAIN RATE;

ACTIVATION VOLUME; DISLOCATION SEGMENTS; GROWTH TWINS; HARDENING CAPACITIES; NANO SCALE; NANOTWINNED COPPER; SEGMENT LENGTHS; STRAIN-RATE SENSITIVITY; TENSILE; TWIN;

DUCTILITY;

EID: 77952880874     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.03.076     Document Type: Article

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