Dropwise condensation in vapor chambers

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2010, Pages 224-227

  Bonner III, Richard W ^a  

^a Advanced Cooling Technologies Inc   (United States)

Author keywords

Dropwise condensation; Electronics cooling; Self assembled monolayers; Thermal management; Vapor chambers

Indexed keywords

AIR COOLED HEAT SINKS; CAPILLARY FORCE; CAPILLARY LIMITS; CONDENSATION HEAT TRANSFER; DROPWISE CONDENSATION; ELECTRONIC DEVICE; ELECTRONICS COOLING; FILMWISE CONDENSATION; HEAT SOURCES; NOVEL METHODS; ORDER OF MAGNITUDE; OTHER APPLICATIONS; SATURATED CONDITIONS; SPREADING RESISTANCE; TEST DATA; THERMAL MANAGEMENT; THERMAL PERFORMANCE; THERMAL RESISTANCE; TWO-PHASE HEAT TRANSFER; VAPOR CHAMBER; WORKING FLUID;

CONDENSATION; HEAT FLUX; HEAT SINKS; HEAT TRANSFER; SELF ASSEMBLED MONOLAYERS; TEMPERATURE CONTROL; THERMAL VARIABLES MEASUREMENT; VAPORS;

HEAT RESISTANCE;

EID: 77952665504     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/STHERM.2010.5444286     Document Type: Conference Paper

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