Use of vapor chambers for thermal management

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn 3, Issue , 1999, Pages 1358-1366

  Mehl, Dale ^a   Dussinger, Pete ^a   Grubb, Kevin ^a  

^a Subsidiary of Modine Mfg Company   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

VAPOR CHAMBER HEAT SINKS;

HEAT FLUX; HEAT RESISTANCE; HEAT TRANSFER;

HEAT SINKS;

EID: 0032638230     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (3)