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Volumn 16, Issue 5, 2010, Pages 799-808
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Adhesive wafer bonding with photosensitive polymers for MEMS fabrication
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVE BONDING;
ADHESIVE WAFER BONDING;
BONDING LAYERS;
COATING PROCESS;
DEVELOPMENT PROCESS;
DIELECTRIC CONSTANTS;
DIFFERENT SUBSTRATES;
INTERMEDIATE LAYERS;
LAYER THICKNESS;
LOW COSTS;
LOW TEMPERATURE PROCESSING;
LOW YOUNG'S MODULUS;
MAXIMUM TEMPERATURE;
MEGASONICS;
MEMS FABRICATION;
ON-WAFER;
PATTERNED FILMS;
PHOTOSENSITIVE POLYMERS;
POLYMER MATERIALS;
STANDARD DEVELOPMENT;
STATISTICAL ANALYSIS;
SURFACE PLANARIZATION;
THERMAL STABILITY;
WAFER BONDING PROCESS;
BONDING;
LIGHT SENSITIVE MATERIALS;
PLASTIC COATINGS;
POLYMERS;
RELIABILITY ANALYSIS;
STANDARDIZATION;
SUBSTRATES;
THERMOGRAVIMETRIC ANALYSIS;
WAVEGUIDES;
WAFER BONDING;
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EID: 77952420587
PISSN: 09467076
EISSN: None
Source Type: Journal
DOI: 10.1007/s00542-009-0977-0 Document Type: Conference Paper |
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Times cited : (13)
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References (5)
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