Adhesive wafer bonding with SU-8 intermediate layers for micro-fluidic applications

ECS Transactions

Volumn 3, Issue 6, 2006, Pages 369-375

  Matthias, T ^a   Mittendorfer, G ^a   Thanner, C ^a   Lindner, P ^a   Glinsner, T ^a   Dragoi, V ^a  

^a EV GROUP   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE WAFER BONDING; DRY FILM LAMINATION; MICROFLUIDIC DEVICES; SPRAY COATING;

ENCAPSULATION; FLUIDIC DEVICES; MICROFLUIDICS;

WAFER BONDING;

EID: 34249101245     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2357088     Document Type: Conference Paper

References (5)

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2. Sheng Li, Carl B Freidhoff, Robert M Younga, Reza Ghodssi, "Fabrication of micronozzles using low-temperature wafer-level bonding with SU-8", J. Micromech. Microeng. 13, 732-738, (2003)
3. P. Svasek, E. Svasek, B. Lendl, M. Vellekoop, "Fabrication of miniaturized fluidic devices using SU-8 based lithography and low temperature wafer bonding", Sensors and Actuators A 115, 591-599, (2004)
4. C. Brubaker, M. Wimplinger, P. Lindner, S. Pargfrieder, "Investigating the Use of Spray-Coating Technology in MEMS Applications" Micro Magazine,; pp 45, March, (2004)
5. D. Johnson, H. Miller, A. Bhandare, J. Molea, H. Luesebrink, S. Pargfrieder, T. Matthias, G. Mittendorfer, "Direct lamination of SU-8 cavities over MEMS components", Proc. MEMS Industry Forum, Semicon Europe (2006)