Technologies to further reduce soft error susceptibility in SOI

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 2009, Pages

  Oldiges, P ^a   Dennard, R ^a   Heidel, D ^a   Ning, T ^a   Rodbell, K ^a   Tang, H ^a   Gordon, M ^a   Wissel, L ^b  

^a IBM RESEARCH   (United States)

^b IBM Research ^*

Author keywords

[No Author keywords available]

Indexed keywords

BODY CONTACTS; PARALLEL DEVICES; SILICON ON INSULATOR DEVICES; SOFT ERROR; SOFT ERROR RATE;

ELECTRON DEVICES;

CARRIER LIFETIME;

EID: 77952376526     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.2009.5424338     Document Type: Conference Paper

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4. H. Dussault et al., Proc. RADECS 93, pp. 509-516, 1993.
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6. P. Oldiges et al., IEEE TNS, 47, p. 2575, 2000.
7. D. Heidel et al., IBM JRD, 52, p. 225, 2008.
8. H. Tang, IBM JRD, 52, p. 233, 2008.
9. T. Ikeda et al., Proc. SOI Conf., p. 159, 1998.
10. J. Cai et al., Proc. SOI Conf., p. 21, 2008.
11. N. Atkinson et al., SEE Symposium Technical Program, 2009.