3D stacked ICs using Cu TSVs and Die to Wafer Hybrid Collective bonding

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 2009, Pages

  Fukushima, Takafumi ^a   Iwata, Eiji ^a   Ohara, Yuki ^a   Noriki, Akihiro ^a   Inamura, Kiyoshi ^a   Lee, Kang Wook ^a   Bea, Jicheol ^a   Tanaka, Tetsu ^a   Koyanagi, Mitsumasa ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; ARRAY PATTERNS; DIFFERENT SIZES; ELECTRICAL CHARACTERISTIC; LIQUID SURFACE TENSION; MECHANICAL PRESSURE; MICRO-BUMPS; MULTI-CHIP; SELF-ASSEMBLED; SELF-ASSEMBLY TECHNIQUE; SI CHIPS; THREE DIMENSIONAL (3D) INTEGRATION;

ELECTRON DEVICES; SELF ASSEMBLY; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SURFACE TENSION; THREE DIMENSIONAL;

WAFER BONDING;

EID: 77952347622     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.2009.5424351     Document Type: Conference Paper

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