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ChemPhysChem

Volumn 11, Issue 7, 2010, Pages 1416-1424

Heat effects upon electrochemical copper deposition on polycrystalline gold

(3) Etzel, Kai D a Bickel, Katrin R a Schuster, Rolf a

a KARLSRUHE INSTITUTE OF TECHNOLOGY (Germany)

Author keywords

Adsorption; Anions; Copper deposition; Electrochemical calorimetry; Under potential deposition

Indexed keywords

ADSORPTION; ELECTROCHEMICAL DEPOSITION; ELECTROCHEMISTRY; NEGATIVE IONS; SULFUR COMPOUNDS; SULFURIC ACID;

COPPER DEPOSITION; DEPOSITION MECHANISM; ELECTROCHEMICAL CONVERSION; ELECTROCHEMICAL COPPER DEPOSITION; POLYCRYSTALLINE AU; POLYCRYSTALLINE GOLD; TEMPERATURE DETECTION; UNDERPOTENTIAL DEPOSITION;

ELECTROCHEMICAL ELECTRODES;

EID: 77952253232 PISSN: 14394235 EISSN: 14397641 Source Type: Journal
DOI: 10.1002/cphc.200900981 Document Type: Article

Times cited : (13)

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