Ultra-low-modulus positive-type photosensitive polyimides (4). Improvement of adhesion strength with copper foil

Journal of Photopolymer Science and Technology

Volumn 22, Issue 3, 2009, Pages 417-422

  Ishii, Junichi ^a   Morita, Keisuke ^b   Hasegawa, Masatoshi ^b  

^a Sony Chemical and Information Device Corporation   (Japan)

^b TOHO UNIVERSITY   (Japan)

Author keywords

Adhesion strength with copper foil; FPC cover layers; Positive type photosensitive polyimide systems; Soluble polyimides; Ultra iow modulus polyimides

Indexed keywords

EID: 77952137416     PISSN: 09149244     EISSN: 13496336     Source Type: Journal    
DOI: 10.2494/photopolymer.22.417     Document Type: Article

References (7)

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