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Volumn 8, Issue 4, 1996, Pages 617-630

Preparation and stress relaxation properties of thermoplastic polysiloxane-block-polyimides

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AMINES; COMPOSITION EFFECTS; ELASTIC MODULI; INTERFACES (MATERIALS); POLYIMIDES; RESIDUAL STRESSES; SILICON WAFERS; SILICONES; STRESS RELAXATION; THERMAL EXPANSION; THERMOPLASTICS;

EID: 0030349897     PISSN: 09540083     EISSN: None     Source Type: Journal    
DOI: 10.1088/0954-0083/8/4/010     Document Type: Article
Times cited : (36)

References (18)
  • 1
    • 0038014174 scopus 로고
    • Tokyo: Nikkan Kogyo Shinbun-sya
    • Ito K (ed) 1990 Silicone Handbook (Tokyo: Nikkan Kogyo Shinbun-sya)
    • (1990) Silicone Handbook
    • Ito, K.1
  • 13
    • 0347252835 scopus 로고
    • New York: Plenum
    • Wilson A M 1984 Polyimides vol 2 (New York: Plenum) p 695
    • (1984) Polyimides , vol.2 , pp. 695
    • Wilson, A.M.1
  • 14
    • 0021653649 scopus 로고
    • New York: Plenum
    • Bolger J C 1984 Polyimides vol 2 (New York: Plenum) p 871
    • (1984) Polyimides , vol.2 , pp. 871
    • Bolger, J.C.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.