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Volumn 8, Issue 4, 1996, Pages 617-630
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Preparation and stress relaxation properties of thermoplastic polysiloxane-block-polyimides
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
AMINES;
COMPOSITION EFFECTS;
ELASTIC MODULI;
INTERFACES (MATERIALS);
POLYIMIDES;
RESIDUAL STRESSES;
SILICON WAFERS;
SILICONES;
STRESS RELAXATION;
THERMAL EXPANSION;
THERMOPLASTICS;
COPOLYIMIDES;
BLOCK COPOLYMERS;
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EID: 0030349897
PISSN: 09540083
EISSN: None
Source Type: Journal
DOI: 10.1088/0954-0083/8/4/010 Document Type: Article |
Times cited : (36)
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References (18)
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