Comparison of stress relief mechanisms of metal films deposited on liquid substrates by thermal evaporating and sputtering

International Journal of Modern Physics B

Volumn 24, Issue 8, 2010, Pages 997-1005

  Yu, Sen Jiang ^a,c   Zhang, Yong Ju ^b,c   Chen, Miao Gen ^a,c  

^a CHINA JILIANG UNIVERSITY   (China)

^b TAIZHOU UNIVERSITY   (China)

^c ZHEJIANG UNIVERSITY   (China)

Author keywords

Internal stress; Liquid substrate; Ordered pattern; Thin film

Indexed keywords

EID: 77951687156     PISSN: 02179792     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0217979210054531     Document Type: Article

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