Application of nonlinear methods in tracking failure test of printed circuit boards under reduced pressure

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 17, Issue 2, 2010, Pages 548-554

  Du, B X ^a   Gu, L ^a   Liu, Yong ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER FOILS; DISCHARGE CURRENTS; DISPERSITY; ELECTRICAL DEVICES; HIGH ALTITUDE; INSULATION DISTANCES; LOW PRESSURES; NON-LINEAR METHODS; RECURRENCE PLOT; REDUCED PRESSURE; TEST SAMPLES; TRACKING FAILURE; TRACKING TESTS; UNDERLYING MECHANISM;

ELECTRONIC CIRCUIT TRACKING; EPOXY RESINS; FRACTAL DIMENSION; LEAD; PARTIAL DISCHARGES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; RESINS;

SURFACE DISCHARGES;

EID: 77951570736     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDEI.2010.5448111     Document Type: Article

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