Development of polypyrrole/epoxy composites as isotropically conductive adhesives

Journal of Adhesion

Volumn 86, Issue 4, 2010, Pages 447-462

  Mir, Irfan Ahmad ^a   Kumar, D ^a  

^a DELHI TECHNOLOGICAL UNIVERSITY   (India)

Author keywords

Conducting polymers; Epoxy polypyrrole composites; Isotropically conductive adhesives; Solder replacement

Indexed keywords

CHEMICAL POLYMERIZATION; CONDUCTIVE ADHESIVE; CURING BEHAVIOR; DODECYL-BENZENE SULPHONIC ACID; DSC AND TGA; EPOXY MATRICES; FILLER CONCENTRATION; IMPACT PROPERTY; INTRINSICALLY CONDUCTING POLYMER; ISOTROPIC CONDUCTIVE ADHESIVES; ISOTROPICALLY CONDUCTIVE ADHESIVES; OVERALL CHARACTERISTICS; SEM OBSERVATION; SOLDER REPLACEMENT; THERMAL DEGRADATION PROPERTIES;

ADHESIVES; BENZENE; CONDUCTING POLYMERS; CURING; ELECTRONICS INDUSTRY; FILLERS; IMPACT STRENGTH; LEAD; ORGANIC ACIDS; ORGANIC CONDUCTORS; POLYPYRROLES; SOLDERING ALLOYS; THERMOGRAVIMETRIC ANALYSIS;

FILLED POLYMERS;

EID: 77951274719     PISSN: 00218464     EISSN: 15455823     Source Type: Journal    
DOI: 10.1080/00218461003704519     Document Type: Article

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