Active solder joining of metals, ceramics and composites

Welding Journal (Miami, Fla)

Volumn 80, Issue 10, 2001, Pages 30-35

  Smith, R W ^a  

^a Materials Resources International   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPOSITE MATERIALS; ELECTRONICS PACKAGING; FILLER METALS; FLUXES; JOINING; THERMAL EXPANSION;

ULTRASONIC POLISHING;

SOLDERING ALLOYS;

EID: 0035484623     PISSN: 00432296     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. Wetting of tin based active solder on sialon ceramic
2. Metal-ceramic interactions: II - Metal oxide interfacial reactions at elevated temperatures
3. Joining ceramic materials
4. Methods for ceramic and metal-cermamic joints
5. Low temperature active joining for electronic applications