A PCB system integration concept for power electronics

2009 IEEE 6th International Power Electronics and Motion Control Conference, IPEMC '09

Volumn , Issue , 2009, Pages 756-762

  Josifović, Ivan ^a   Popović Gerber, Jelena ^a   Ferreira, Jan Abraham ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATED MANUFACTURING; CONSTRUCTION TECHNOLOGIES; DOUBLE SIDED; FLYBACK CONVERTERS; HIGH-DENSITY PACKAGING; MANUFACTURING METHODS; PASSIVE COMPONENTS; PLANAR SUBSTRATE; POWER DENSITIES; STANDARD COMPONENTS; SYSTEM INTEGRATION; THERMAL DESIGNS; THERMAL MANAGEMENT;

MOTION CONTROL; MOTION PLANNING; POLYCHLORINATED BIPHENYLS; POWER CONVERTERS; PRINTED CIRCUITS;

POWER ELECTRONICS;

EID: 77951119831     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPEMC.2009.5157486     Document Type: Conference Paper

References (10)

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3. rd Annual IEEE Power Electronics Specialists Conference (PESC'02), June 23-27, 2002
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5. E. Waffenschmidt, B. Ackermann, and J. A. Ferreira, "Design Method and Material Technologies for Passives in Printed Circuit Board Embedded Circuits", IEEE Transaction on Power Electronics, May 2005
6. J. Popović, "Improving packaging and increasing the level of integration in power electronics", PhD thesis, Delft University of Technology, Delft, November 2005
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