Measurements of microhardness and thermal and electrical properties of the binary Zn-0.7wt.%Cu hypoperitectic alloy

Journal of Electronic Materials

Volumn 39, Issue 3, 2010, Pages 303-311

  Kaya, H ^a   Boyuk U ^a   EngIn S ^a   Cadirli E ^b   Marasli N ^a  

^a ERCIYES UNIVERSITY   (Turkey)

^b NIGDE UNIVERSITY   (Turkey)

Author keywords

Cellular microstructure; Electrical conductivity; Enthalpy; Lorenz coefficient; Microhardness; Specific heat; Zn Cu alloy

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY; ENTHALPY; GROWTH RATE; HVDC POWER TRANSMISSION; MICROHARDNESS; SPECIFIC HEAT; THERMAL CONDUCTIVITY; THERMAL GRADIENTS;

CELLULAR MICROSTRUCTURE; CONSTANT GROWTH RATES; CU ALLOY; DIRECTIONALLY SOLIDIFIED; ELECTRICAL CONDUCTIVITY; FOUR-POINT PROBE TECHNIQUES; LORENZ COEFFICIENT; THERMAL AND ELECTRICAL PROPERTIES;

ZINC ALLOYS;

EID: 77951023287     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-1061-3     Document Type: Article

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