Inspection of through silicon vias (TSV) and other interconnections in IC packages by computed tomography

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2009, Pages 438-441

  Roth, Holger ^a   He, Zhenhui ^b   Mayer, Thomas ^b  

^a General Electric Sensing and Inspection Technologies GmbH   (Germany)

^b NONE   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTED TOMOGRAPHY; IC PACKAGE; INTEGRATED ELECTRONICS; NANO-CT; NANO-FOCUS; NUMERICAL PROCESSING; THROUGH SILICON VIAS; VOLUMETRIC DATA;

COMPUTERIZED TOMOGRAPHY; ELECTRONICS PACKAGING; INTERCONNECTION NETWORKS; VOLUMETRIC ANALYSIS;

PACKAGING;

EID: 77950933702     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2009.5416506     Document Type: Conference Paper

References (5)

1. Jiang, Tom and Luo, Shijian, "3D Integration - Present and Future", 10th Electronics Packaging Technology Conference, Singapore 2008, pp. 373-378, and references cited therein
2. Tummala, Rao, "Changing Role of Packaging From ICs to 3D Ics to 3D Systems", 17th European Microelectronics and Packaging Cconference, Rimini 2009
3. Brunke, Oliver, et al. "Comparison between X-ray tube based and synchrotron radiation based μCT", Proc. Developments in X-ray Tomography, SPIE Int. Symposion of Opical Engineering & Applications , San Diego, CA, Aug. 2008
4. Roth, Holger, He, Zhenhui, and Paul, Thomas, "IC Package Inspection with nanofocus X-ray tubes and nanoCT", 10th Electronics Packaging Technology Conference, Singapore 2008, pp. 644-649
5. Wolter, Klaus-Jürgen, Oppermann, Martin and Zerna, Thomas, "Nano Packaging - A Challenge for Non-destructive Testing", 10th Electronics Packaging Technology Conference, Singapore 2008, pp. 873-878