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Volumn , Issue , 2009, Pages 2428-2431

Modeling of arbitrary power-ground planes with slot by using integral equation and transmission line method

Author keywords

Electronic packaging; Equivalent circuit; Integral equation; Power signal integrity

Indexed keywords

COMMERCIAL SIMULATORS; COMMERCIAL SOFTWARE; COUPLED INTEGRAL EQUATIONS; COUPLED MICROSTRIP LINES; COUPLING EFFECT; ELECTRONIC PACKAGING; EQUIVALENT CIRCUIT METHOD; LUMPED-CIRCUIT; NARROW SLOT; POWER-GROUND PLANES; STRONG COUPLING; TRANSMISSION LINE; TRANSMISSION LINE METHODS;

EID: 77950667174     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APMC.2009.5385477     Document Type: Conference Paper
Times cited : (5)

References (9)
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    • High frequency characterization of power/ground-plane structures
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    • C. T. Lei, R. W. Techentin, and B. K. Gilbert, "High frequency characterization of power/ground-plane structures," IEEE Trans. Microw. Theory Tech., vol.47, no.5, pp. 562-569, May. 1999.
    • (1999) IEEE Trans. Microw. Theory Tech. , vol.47 , Issue.5 , pp. 562-569
    • Lei, C.T.1    Techentin, R.W.2    Gilbert, B.K.3
  • 4
    • 0036589412 scopus 로고    scopus 로고
    • Modeling of Multilayered Power Distribution Planes Using Transmission Matrix Method
    • MAY
    • J. H. Kim and M. Swaminathan, "Modeling of Multilayered Power Distribution Planes Using Transmission Matrix Method," IEEE Trans. Advanced Packaging, vol.25, no.2, pp. 189-199, MAY 2000.
    • (2000) IEEE Trans. Advanced Packaging , vol.25 , Issue.2 , pp. 189-199
    • Kim, J.H.1    Swaminathan, M.2
  • 5
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    • Circuit models for three-dimensional geometries including dielectrics
    • Jul.
    • A. E. Ruehli and H. Heeb, "Circuit models for three-dimensional geometries including dielectrics," IEEE Trans. Microw. Theory Tech., vol40, no.7, pp. 1507-1515, Jul. 1992
    • (1992) IEEE Trans. Microw. Theory Tech. , vol.40 , Issue.7 , pp. 1507-1515
    • Ruehli, A.E.1    Heeb, H.2
  • 6
    • 2442447244 scopus 로고    scopus 로고
    • A coupled efficient and systematic full wave time domain macromodeling and circuit simulation for high speed interconnects
    • Feb.
    • E. P. Li, E. X. Liu, L.W. Li, and M. S. Leong, "A coupled efficient and systematic full wave time domain macromodeling and circuit simulation for high speed interconnects," IEEE Trans. Adv. Packag., vol.27, no.1, pp. 213-223, Feb. 2004.
    • (2004) IEEE Trans. Adv. Packag. , vol.27 , Issue.1 , pp. 213-223
    • Li, E.P.1    Liu, E.X.2    Li, L.W.3    Leong, M.S.4
  • 7
    • 51049117696 scopus 로고    scopus 로고
    • Efficient modeling of re-routed return currents in multilayered power-ground planes by using integral equation
    • Aug.
    • X. C. Wei, E. P. Li, E. X. Liu, and X. Cui, "Efficient modeling of re-routed return currents in multilayered power-ground planes by using integral equation," IEEE Trans. Electromagn. Compat., vol.50 , no.3, pp. 740-743, Aug. 2008.
    • (2008) IEEE Trans. Electromagn. Compat. , vol.50 , Issue.3 , pp. 740-743
    • Wei, X.C.1    Li, E.P.2    Liu, E.X.3    Cui, X.4
  • 9
    • 77950644800 scopus 로고    scopus 로고
    • Available
    • Ansoft software. Available: http://www.ansoft.com.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.